SFM-126-02-H-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-126-02-H-D-A-K-TR is a 52-position dual-row surface-mount socket strip with 0.050" (1.27 mm) pitch, designed for high-reliability mezzanine board-to-board interconnects. Gold-plated contacts and tape-and-reel packaging support high-volume automated assembly. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 52
- Lifecycle
- ACTIVE
- Datasheet
- SFM-126-02-H-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 52-position dual-row layout at 0.050" (1.27 mm) pitch balances signal density and compact PCB footprint
- Tape-and-reel (TR) packaging optimized for automated pick-and-place reflow soldering processes
- High-reliability gold-plated contacts engineered for low contact resistance across extended mating cycles
Applications
The SFM-126-02-H-D-A-K-TR is used in intermediate-density mezzanine interconnect applications including embedded processor daughter cards, network switch line cards, and test and measurement instrumentation requiring reliable 52-signal bus routing. Its surface-mount form factor and 0.050" pitch allow designers to maintain a minimal PCB footprint while supporting full-speed digital signal transmission.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What are the row and pitch specifications of the SFM-126-02-H-D-A-K-TR socket strip?
The SFM-126-02-H-D-A-K-TR is a 52-position component arranged in 2 rows at 0.050" (1.27 mm) pitch, providing 26 contacts per row and enabling connection of up to 52 individual signals in a surface-mount package suitable for dense PCB layouts.
How does the H-height option affect clearance in a board-to-board stacking application?
The H suffix on the SFM-126-02-H designates a taller insulator body height variant, providing additional standoff clearance of approximately 2.5 mm above the PCB surface to accommodate components or routing layers on the mating board without contact interference.
In which applications does the SFM-126-02-H-D-A-K-TR provide a cost-effective mid-range pin count solution?
For designs requiring between 40 and 60 signal lines, such as FPGA evaluation boards, protocol bridge modules, and 50-Ω controlled-impedance bus interfaces operating at signal rates up to 3 Gbps, the 52-position SFM-126 provides the exact pin count needed without routing unused positions, reducing BOM cost and PCB complexity.
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