SFM-125-L2-ZZ-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-125-L2-ZZ-D-A-K-TR is a 50-position dual-row high-reliability surface mount socket strip at 0.050" (1.27 mm) pitch with a 2 mm stacking height and tape-and-reel packaging for automated assembly. Engineered for fine-pitch mezzanine board-to-board interconnects in space-constrained designs. From $4.20 each in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 50
- Lifecycle
- ACTIVE
- Datasheet
- SFM-125-L2-ZZ-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-125-L2-ZZ-D-A-K-TR?
- 50-position dual-row surface mount socket at 0.050" (1.27 mm) pitch and 2 mm stacking height for ultra-compact board-to-board mezzanine connections
- High-reliability gold-plated contacts rated for 200+ mating cycles supporting repeated board swapping in test, defense, and modular embedded systems
- Tape-and-reel (TR) packaging enables automated pick-and-place SMT assembly, reducing handling errors in high-volume PCB production
- ZZ (no polarization slot) option provides maximum layout flexibility for symmetric or custom board orientation in embedded module designs
What is SFM-125-L2-ZZ-D-A-K-TR used for?
The SFM-125-L2-ZZ-D-A-K-TR is used in ultra-compact mezzanine stacking applications for FPGAs, microprocessors, and wireless communication modules where 50 signals must be routed at 0.050" pitch with minimal board clearance. Its 2 mm stacking height supports thin sandwich PCB assemblies in portable industrial scanners, medical wearables, and drone avionics. Tape-and-reel delivery and reflow-compatible design streamline high-volume SMT manufacturing for IoT and embedded computing platforms.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-125-L2-ZZ-D-A-K-TR datasheet?
SFM-125-L2-ZZ-D-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-125-L2-ZZ-D-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What position count, pitch, and stacking height does the SFM-125-L2-ZZ-D-A-K-TR offer?
The SFM-125-L2-ZZ-D-A-K-TR provides 50 positions in a dual-row layout at 0.050" (1.27 mm) pitch with a 2 mm board-to-board stacking height. This combination supports high-density signal routing for compact embedded modules and wireless SoC daughter cards where both signal count and vertical clearance are critical design constraints.
How does the 2 mm stacking height of SFM-125-L2-ZZ-D-A-K-TR benefit thin product designs?
A 2 mm stacking height is among the lowest available for 50-position surface mount socket strips, enabling slim sandwich PCB assemblies with a combined profile under 5 mm when mated. This is essential for portable medical devices, wearables, and compact IoT hardware where a total thickness below 10 mm is required and every millimeter of vertical space is constrained.
For what manufacturing volumes is the tape-and-reel format of SFM-125-L2-ZZ-D-A-K-TR most beneficial?
Tape-and-reel packaging is optimized for production volumes exceeding 500 units per run, where automated pick-and-place machines can place components at rates of 5,000 to 20,000 parts per hour. Manual tray or cut-tape options suit prototyping and small batches under 100 units, while the TR format minimizes handling costs and misplacement errors at scale.
When would SFM-125-L2-ZZ-D-A-K-TR be chosen over a standard 0.100" pitch socket for a 50-signal interface?
The 0.050" (1.27 mm) pitch of the SFM-125-L2-ZZ-D-A-K-TR occupies half the PCB area of a 0.100" (2.54 mm) equivalent, fitting 50 contacts within approximately 32 mm versus 64 mm for the standard pitch version. This makes it the preferred option for FPGA daughter cards, camera modules, and RF front-end boards where PCB area costs are high and layout density is a primary design driver.
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