SFM-125-L2-H-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-125-L2-H-D-A-K is a 50-position dual-row high-reliability surface mount socket strip at 0.050" (1.27 mm) pitch with gold-plated contacts and an elevated housing height. Designed for fine-pitch board-to-board stacking requiring additional mating clearance, with straight SMT tails for standard reflow assembly. Available from stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 50
- Lifecycle
- ACTIVE
- Datasheet
- SFM-125-L2-H-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 50-position dual-row SMT socket strip at 0.050" (1.27 mm) pitch providing 25 contacts per row for high-density mezzanine and expansion interconnects
- Elevated (H) housing height increases mating clearance to accommodate taller components between stacked boards in constrained assemblies
- Gold-plated contacts (K suffix) ensure contact resistance below 20 mΩ and extended reliability across hundreds of mating cycles in demanding environments
Applications
The SFM-125-L2-H-D-A-K is suited for high-density mezzanine board stacking, FPGA expansion cards, and modular embedded systems where 50 contacts at 0.050" pitch must bridge boards with larger inter-board clearance. Its elevated housing height accommodates taller surface-mount components mounted between the stacked boards, a key requirement for telecom line cards and advanced data acquisition platforms. Gold-plated contacts ensure long-term electrical stability in both commercial and industrial temperature environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the contact count and per-row arrangement of SFM-125-L2-H-D-A-K?
SFM-125-L2-H-D-A-K provides 50 total positions in a dual-row layout with 25 contacts per row at 0.050" (1.27 mm) pitch. This high contact density within a compact SMT footprint supports 50 simultaneous signal or power connections, making it appropriate for FPGA mezzanine modules, high-speed serial interfaces, and modular embedded processor boards.
When is the elevated-height (H) housing of SFM-125-L2-H-D-A-K preferred over a standard-height socket?
The elevated (H) housing variant provides a mating height approximately 2 mm to 4 mm taller than a standard socket, creating clearance for components populated between stacked boards. Choose SFM-125-L2-H-D-A-K when bulky SMD capacitors, ferrite beads, or fine-pitch ICs taller than 2 mm occupy the inter-board gap on either mating PCB, preventing physical interference that would otherwise prevent board mating.
How does SFM-125-L2-H-D-A-K differ from SFM-123-T2-S-D-A-K in terms of capacity and height?
SFM-125-L2-H-D-A-K has 50 positions versus 46 positions on SFM-123-T2-S-D-A-K, providing 4 additional contacts (2 per row) at the same 0.050" (1.27 mm) pitch. Additionally, SFM-125-L2-H-D-A-K uses an elevated (H) housing versus the standard height on the 46-position model, giving an extra 2 mm to 4 mm of board-to-board clearance for designs with taller inter-board components.
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