SFM-125-02-ZZ-D-A-K-TR SAMTEC Connector (Other) In Stock
The SAMTEC SFM-125-02-ZZ-D-A-K-TR is a 50-position, dual-row, surface-mount high-reliability socket strip with 0.050-inch pitch. It features gold-plated contacts for dependable signal integrity and is supplied in tape-and-reel format for automated SMT assembly. Ideal for board-to-board interconnect in telecommunications and computing applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 50
- Lifecycle
- ACTIVE
- Datasheet
- SFM-125-02-ZZ-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 50-position dual-row surface-mount socket strip with 0.050 inch pitch for high-density interconnects
- Tape-and-reel (TR) packaging enables automated SMT pick-and-place for high-volume manufacturing
- Gold-plated contacts provide reliable, low-contact-resistance mating across extended insertion cycles
Applications
The SFM-125-02-ZZ-D-A-K-TR is used in high-density board-to-board interconnect applications for computing, networking, and industrial control systems requiring a 50-position, 0.050-inch pitch socket interface. Its surface-mount, tape-and-reel format makes it compatible with automated SMT reflow assembly for volume production. The dual-row configuration maximizes signal density in compact PCB layouts.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count does the SFM-125-02-ZZ-D-A-K-TR socket strip offer?
The SFM-125-02-ZZ-D-A-K-TR provides 50 positions arranged in a dual-row layout on a 0.050-inch pitch, enabling high-density board-to-board signal connections in surface-mount PCB designs for computing and networking applications.
Is the SFM-125-02-ZZ-D-A-K-TR suitable for automated assembly lines, and what packaging does it come in?
The SFM-125-02-ZZ-D-A-K-TR is supplied in tape-and-reel (TR) packaging, making it fully compatible with automated SMT pick-and-place machines. Its surface-mount 50-position, 0.050-inch pitch design supports high-volume reflow soldering processes.
When would a designer choose SFM-125-02-ZZ-D-A-K-TR over a through-hole alternative for a 50-position board-to-board interface?
For designs needing high-density interconnects with automated assembly capability, the SFM-125-02-ZZ-D-A-K-TR surface-mount format is preferred. Its 0.050-inch pitch and tape-and-reel packaging reduce board space by up to 40% compared to through-hole alternatives, while enabling reflow soldering in modern SMT production lines.
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