SFM-124-T2-SM-D-A-P-TR SAMTEC Connector (Other) In Stock

What are the key features of SFM-124-T2-SM-D-A-P-TR?

• 48-position dual-row configuration at 0.050" (1.27 mm) pitch for high-density board-to-board signal routing
• Tape-and-reel (-TR) packaging enables automated SMT pick-and-place assembly in high-volume production
• High-reliability gold-plated contacts for low contact resistance and extended mating cycle life
• Surface mount termination supports reflow soldering for consistent solder joint quality across all 48 positions
• Compatible with Samtec SFM/SFH mating headers for flexible mezzanine stack-height configurations

What is SFM-124-T2-SM-D-A-P-TR used for?

The SFM-124-T2-SM-D-A-P-TR is designed for board-to-board mezzanine interconnect in FPGA daughtercard assemblies, embedded computing modules, and high-speed communications equipment requiring 48 dual-row signal connections at 0.050" pitch. Its tape-and-reel packaging makes it ideal for high-volume automated SMT production lines in industrial electronics and telecommunications hardware. The high-reliability construction ensures stable electrical performance in demanding environments such as defense, aerospace, and data center computing platforms.

Compliance & Regulatory

Where can I find the SFM-124-T2-SM-D-A-P-TR datasheet?

Official datasheet from SAMTEC

Related Guides