SFM-124-L2-F-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-124-L2-F-D-A-P-TR is a 48-position dual-row high-reliability socket strip at 0.050" pitch in a surface mount package with tape-and-reel packaging and low-profile L2 standoff. Built for precision mezzanine board-to-board stacking with controlled stack height. Available from authorized distributors worldwide.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 48
- Lifecycle
- ACTIVE
- Datasheet
- SFM-124-L2-F-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 48-position dual-row SMT socket at 0.050" pitch with L2 low-profile standoff defining precise board-to-board stack height for controlled mezzanine assembly clearance
- High-reliability SAMTEC SFM series contact system rated for extended mating cycles, suitable for hot-swap daughtercards and modular blade server configurations
- Tape-and-reel (TR) delivery with 0.050" SMT footprint enables automated pick-and-place placement with consistent orientation for high-volume reflow assembly processes
Applications
The SFM-124-L2-F-D-A-P-TR is designed for mezzanine card stacking on FPGA evaluation platforms, communication blades, and embedded computing modules where 48 signal lines must interconnect across two PCBs at a precisely controlled 0.050" pitch board separation. The L2 standoff height enables a defined air gap between boards for thermal management and mechanical stability in rack-mount or handheld enclosures.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What role does the L2 standoff designation play in determining the mezzanine stack height with the SFM-124-L2-F-D-A-P-TR?
The L2 designation specifies a defined standoff height integrated into the 48-position socket body that sets the board-to-board separation in a mezzanine stack. At 0.050" contact pitch, this precise stack height is critical for consistent electrical mating depth and for maintaining clearance between components on both the top and bottom boards in the assembly.
How does the SFM-124-L2-F-D-A-P-TR compare to the SFM-124-T2-F-D-A-P-TR in terms of board stacking geometry?
The SFM-124-L2-F-D-A-P-TR uses an L2 low-profile standoff for reduced stack height mezzanine assemblies, while the T2 variant uses a taller standoff for applications requiring more board separation clearance. Both share the 48-position dual-row 0.050" pitch configuration, so designers can swap between L2 and T2 to adjust the board-to-board gap without changing the PCB footprint.
What advantage does the 0.050" pitch of the SFM-124-L2-F-D-A-P-TR provide over 0.100" pitch alternatives in high-density designs?
At 0.050" pitch, the SFM-124-L2-F-D-A-P-TR fits 48 positions in approximately half the board length compared to a 0.100" pitch strip carrying the same pin count. This halved footprint is critical in FPGA or SoC mezzanine applications where dozens of high-speed differential pairs and power rails must route across a board-to-board interface within a constrained PCB area.
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