SFM-123-T2-S-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-123-T2-S-D-A-K is a 46-position dual-row high-reliability surface mount socket strip at 0.050" (1.27 mm) pitch with gold-plated contacts. Engineered for fine-pitch mezzanine and daughtercard stacking, it provides robust SMT attachment and a straight-post entry receptacle configuration. Available from stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 46
- Lifecycle
- ACTIVE
- Datasheet
- SFM-123-T2-S-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 46-position dual-row SMT socket strip at 0.050" (1.27 mm) pitch delivering high-density connectivity for mezzanine and expansion card interfaces
- Gold-plated contacts (K suffix) maintain stable contact resistance below 20 mΩ across hundreds of mating cycles for long-term field reliability
- Straight SMT solder tails allow standard reflow assembly up to 260°C peak, compatible with lead-free production processes
Applications
The SFM-123-T2-S-D-A-K is used in mezzanine card stacking, FPGA expansion modules, and high-density board-to-board interconnect designs where 46 contacts at 0.050" pitch provide broad signal and power routing within a compact area. Telecom line cards, rugged embedded computers, and data acquisition systems rely on this connector for reliable fine-pitch board stacking. The gold contact finish ensures consistent electrical performance throughout the product lifetime.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many contacts does SFM-123-T2-S-D-A-K have and what is the row configuration?
SFM-123-T2-S-D-A-K has 46 total positions arranged in 2 rows of 23 contacts each at 0.050" (1.27 mm) pitch. This dual-row layout at fine pitch allows 46 simultaneous connections within a footprint narrower than 3 mm wide, making it suitable for compact FPGA mezzanine modules and high-density daughtercard interfaces.
For a ruggedized embedded system, how reliable is SFM-123-T2-S-D-A-K in thermal cycling environments?
SFM-123-T2-S-D-A-K features gold-plated contacts that resist oxidation and fretting corrosion during thermal cycling from -55°C to +125°C. The SMT solder joints, once reflowed at up to 260°C peak, bond rigidly to the PCB and are rated for over 500 thermal cycles in SAMTEC's standard qualification tests. Contact resistance remains below 20 mΩ throughout this range, ensuring signal integrity in ruggedized industrial and military-adjacent environments.
Can SFM-123-T2-S-D-A-K replace SFM-123-T2-S-D-A-K-TR if tape-and-reel packaging is unavailable?
Yes. SFM-123-T2-S-D-A-K (tray/strip packaging) is electrically and mechanically identical to the TR (tape-and-reel) variant, providing the same 46-position 0.050" pitch dual-row socket with gold contacts. The packaging difference affects only the feeding method for pick-and-place machines: tray packaging suits smaller production runs or manual assembly, while TR packaging is optimized for high-volume automated SMT lines consuming thousands of connectors per reel.
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