SFM-123-T2-FM-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-123-T2-FM-D-A-P-TR is a 46-position, dual-row, 0.050 inch pitch high-reliability surface-mount socket strip with 92 total contacts, featuring a floating-mount (FM) design and press-fit retention, supplied in tape-and-reel. Compensates for PCB misalignment in dense mezzanine stacking applications. Available with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 46
- Lifecycle
- ACTIVE
- Datasheet
- SFM-123-T2-FM-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-123-T2-FM-D-A-P-TR?
- 92 total contacts (46 positions, dual-row) on 0.050 inch (1.27 mm) pitch, delivering high I/O density for FPGA mezzanine boards and multi-function expansion modules
- Floating-mount (FM) construction accommodates lateral PCB misalignment during assembly, reducing mechanical stress on solder joints in stacked board assemblies subject to thermal cycling
- High-reliability socket design with gold-plated contacts and press-fit retention, rated for consistent electrical performance across hundreds of mating cycles in demanding applications
What is SFM-123-T2-FM-D-A-P-TR used for?
The SFM-123-T2-FM-D-A-P-TR is designed for high-density mezzanine stacking in FPGA expansion platforms, signal processing modules, and industrial embedded systems that require a reliable 92-pin SMT socket at 0.050 inch pitch. The floating-mount feature absorbs manufacturing tolerances and thermal expansion differences between stacked boards, preserving solder joint integrity over the product lifetime. Supplied in tape-and-reel, the part integrates seamlessly into automated SMT assembly workflows for mid-to-high volume production.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-123-T2-FM-D-A-P-TR datasheet?
SFM-123-T2-FM-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-123-T2-FM-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
For an FPGA mezzanine module with 92 signal and power pins, why is the SFM-123-T2-FM-D-A-P-TR's dual-row 0.050 inch pitch layout preferable to a single-row 0.100 inch pitch alternative?
A dual-row 0.050 inch pitch arrangement fits 92 contacts in approximately 58.4 mm of board length, while a single-row 0.100 inch pitch connector would need 91 positions in a 228.6 mm row to carry the same 92 signals. The SFM-123-T2-FM-D-A-P-TR's compact footprint is essential for FPGA mezzanine modules where board area is constrained and high I/O density is required for parallel bus, memory, or mixed signal interfaces.
How does the floating-mount design of the SFM-123-T2-FM-D-A-P-TR protect solder joints in a stacked PCB assembly during temperature cycling?
When two PCBs are stacked with 92 rigid contacts and no float, differential thermal expansion between the carrier and mezzanine boards creates lateral shear forces on each solder joint during temperature cycling. The floating-mount construction of the SFM-123-T2-FM-D-A-P-TR absorbs up to approximately ±0.3 mm of misalignment, decoupling the solder joints from these thermal expansion forces. This extends solder joint fatigue life significantly in applications cycling between -40°C and +85°C or wider temperature ranges.
When ordering the SFM-123-T2-FM-D-A-P-TR for a production run, what does the T2 suffix indicate and how does it affect compatibility with mating headers?
The T2 suffix in the SFM-123-T2-FM-D-A-P-TR designates a specific standoff or stacking height variant, determining the mated board-to-board separation. Common T2 configurations result in a stacked height of approximately 5 mm to 8 mm depending on the Samtec SFM series options. Designers must select a matching TSM or TFM header with the same T2 height specification to achieve the intended board separation and maintain contact engagement depth, as mixing height suffixes would result in over- or under-insertion of the 92-pin interface.
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