SFM-123-L2-S-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-123-L2-S-D-A-K is a 46-position, dual-row, high-reliability SMT socket strip with 1.27 mm (0.050 inch) pitch. Gold-plated contacts ensure low-resistance mating for thousands of insertion cycles. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 46
- Lifecycle
- ACTIVE
- Datasheet
- SFM-123-L2-S-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 46 total positions in dual-row 1.27 mm pitch SMT socket for high-density fine-pitch board-to-board mating
- High-reliability gold-plated contacts maintain stable contact resistance below 30 mΩ across thousands of mating cycles
- Surface mount construction supports automated reflow soldering for integration into standard SMT production lines
Applications
SFM-123-L2-S-D-A-K is ideal for high-density mezzanine interconnects in aerospace, defense, and industrial electronics where a 46-position, 1.27 mm pitch dual-row socket is required. Its high-reliability gold-plated contacts withstand harsh environmental conditions including temperature extremes and vibration. The SMT form factor enables fully automated PCB assembly without manual through-hole soldering, reducing manufacturing cost in high-volume programs.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What position count and pitch define the SFM-123-L2-S-D-A-K for mezzanine applications?
SFM-123-L2-S-D-A-K provides 46 total positions in a dual-row layout (23 per row) with a 1.27 mm (0.050 inch) pitch. This fine-pitch configuration enables compact mezzanine and board-to-board interconnects in systems where PCB real estate is limited and high I/O counts are required.
How does the gold plating on SFM-123-L2-S-D-A-K extend the service life of board-to-board connections?
The gold-plated contacts of SFM-123-L2-S-D-A-K resist oxidation and corrosion, maintaining contact resistance typically below 30 mΩ across thousands of mating and unmating cycles. This is substantially more durable than tin-plated alternatives, which can see resistance increase after a few hundred cycles, making gold essential for safety-critical or frequently serviced equipment.
Can SFM-123-L2-S-D-A-K be assembled using standard automated SMT processes?
Yes. SFM-123-L2-S-D-A-K uses surface mount tails designed for reflow soldering at peak temperatures around 260 °C, compatible with J-STD-020 SMT assembly profiles. Its form factor supports automated pick-and-place placement, eliminating the need for manual through-hole insertion and wave-soldering operations on high-volume production boards.
In which application domains is SFM-123-L2-S-D-A-K most commonly specified?
SFM-123-L2-S-D-A-K is most frequently specified in aerospace avionics, defense embedded computing, and industrial motor-control modules requiring a reliable 46-pin, 1.27 mm pitch SMT socket. It also appears in medical diagnostic and scientific instrumentation boards where repeated board removal and reinstallation demands high-cycle gold-plated contacts that maintain signal integrity over the equipment's operational life.
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