SFM-123-L2-LM-D-A-K SAMTEC Connector (Other) In Stock
The SAMTEC SFM-123-L2-LM-D-A-K is a 46-position dual-row high-reliability socket strip with 1.27 mm (0.050 inch) pitch for surface-mount applications. It features gold-plated contacts with Tiger Eye technology for superior mating reliability across demanding interconnect needs. Stocked globally and available for immediate worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 46
- Lifecycle
- ACTIVE
- Datasheet
- SFM-123-L2-LM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 46-position dual-row layout at 1.27 mm (0.050 inch) pitch for high-density surface-mount interconnect
- Tiger Eye contact technology delivering low insertion force and reliable mating across extended cycle life
- Gold-plated mating contacts with nickel barrier for corrosion resistance and consistent low contact resistance
- High-reliability socket strip design suited for industrial, military, and aerospace PCB applications
- Surface-mount termination compatible with standard lead-free reflow soldering processes
Applications
The SFM-123-L2-LM-D-A-K is designed for high-density board-to-board and board-to-mezzanine interconnect in applications such as embedded computing modules, FPGA daughter cards, and mil-aero avionics systems. Its 1.27 mm pitch dual-row configuration allows 46 positions in a compact footprint, making it a preferred choice for signal-intensive backplane and expansion card designs. The surface-mount format integrates seamlessly into automated SMT assembly workflows for both prototype and production volumes.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and what pitch does the SFM-123-L2-LM-D-A-K offer for board-to-board connections?
The SFM-123-L2-LM-D-A-K provides 46 positions arranged in a dual-row configuration at a 1.27 mm (0.050 inch) pitch, delivering 23 contacts per row. This compact pitch allows high-density signal routing in space-constrained PCB layouts while maintaining sufficient mechanical stability for reliable SMT solder joints under vibration and thermal cycling conditions.
Which embedded computing or FPGA expansion designs benefit most from the SFM-123-L2-LM-D-A-K?
FPGA mezzanine cards, system-on-module (SOM) carrier boards, and high-speed data acquisition daughter cards with 46 signal lines benefit directly from the SFM-123-L2-LM-D-A-K at 1.27 mm pitch. Its gold-plated Tiger Eye contacts maintain contact resistance below 20 mΩ across repeated mating cycles, ensuring signal integrity for differential pairs running at hundreds of MHz in compact embedded platforms.
What makes the SFM-123-L2-LM-D-A-K suitable for high-reliability military or aerospace PCB assemblies?
The SFM-123-L2-LM-D-A-K uses beryllium copper contacts with gold plating and a nickel diffusion barrier, meeting the contact material requirements of high-reliability applications operating across temperature ranges from -55 °C to +125 °C. Tiger Eye contact geometry provides consistent normal force and wiping action, reducing the risk of intermittent connections in vibration-prone aerospace and defense environments where connector failure is not an option.
Can the SFM-123-L2-LM-D-A-K be used in lead-free reflow soldering processes?
Yes, the SFM-123-L2-LM-D-A-K is compatible with lead-free SAC305 reflow soldering at peak temperatures up to 260 °C, per standard IPC/JEDEC J-STD-020 reflow profiles. The tin-with-nickel-barrier termination finish wets reliably with lead-free solder paste, and the connector body material is rated to withstand the thermal profile without warping, making it suitable for RoHS-compliant production lines.
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