SFM-122-T2-LM-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-122-T2-LM-D-A-P-TR is a 44-position dual-row high-reliability socket strip with 0.050" pitch for surface-mount mezzanine and daughter-card board-to-board connections. Features low-mount (LM) profile and T2 tail length for reduced stack height in compact PCB assemblies. Available in tape-and-reel format with worldwide distribution.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 44
- Lifecycle
- ACTIVE
- Datasheet
- SFM-122-T2-LM-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-122-T2-LM-D-A-P-TR?
- 44 positions in dual-row 0.050-inch pitch SMT configuration for compact board-to-board mezzanine stacking
- Low-mount (LM) profile minimizes stack height for space-constrained multi-board assemblies
- T2 tail option provides optimized solder tail length for precise SMT pad engagement
- High-reliability gold-plated contacts designed for repeated mating cycles in industrial environments
- Tape-and-reel (-TR) packaging enables automated pick-and-place SMT production at scale
What is SFM-122-T2-LM-D-A-P-TR used for?
The SFM-122-T2-LM-D-A-P-TR is well suited for compact mezzanine board connections in portable instrumentation, IoT gateway modules, and low-profile embedded computing cards where 44 dual-row contacts at 0.050-inch pitch are required within a minimal stack height. The low-mount construction makes it ideal for designs where total board stack height must remain below 10 mm, such as wearable medical devices, industrial sensor nodes, and compact FPGA module boards.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-122-T2-LM-D-A-P-TR datasheet?
SFM-122-T2-LM-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-122-T2-LM-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the LM (low-mount) designation mean for stack height in SFM-122-T2-LM-D-A-P-TR assemblies?
The LM (low-mount) suffix indicates a reduced housing height compared to standard SFM variants, enabling board-to-board mezzanine stacks with a total mated height of approximately 4 mm to 6 mm depending on the matching header variant. For 44-position dual-row connections at 0.050-inch pitch, this reduced profile is essential in portable instruments and wearable electronics where overall assembly thickness must stay below 10 mm.
For a 44-contact dual-row mezzanine interface, what footprint length does SFM-122-T2-LM-D-A-P-TR occupy on the PCB?
With 22 positions per row at 0.050-inch (1.27 mm) pitch, the SFM-122-T2-LM-D-A-P-TR occupies a PCB footprint length of approximately 1.1 inches (27.9 mm) for the dual-row contact array. This compact 44-position surface-mount footprint fits easily on small form-factor PCBs such as Arduino-class modules, COM Express carrier cards, and custom sensor interface boards.
Which header series mates with SFM-122-T2-LM-D-A-P-TR, and what is a typical contact resistance for the mated pair?
The SFM-122-T2-LM-D-A-P-TR mates with SAMTEC TSM or TFM dual-row headers at 0.050-inch pitch, forming a 44-position board-to-board pair with typical contact resistance of less than 20 milliohms per contact. This low contact resistance ensures minimal voltage drop across the 44-position interface even when distributing mixed signal and power connections through the mezzanine stack.
How does the T2 tail length option affect PCB pad design and reflow soldering of this surface-mount socket?
The T2 tail designation specifies a particular solder tail length that matches a standard SMT pad land pattern, ensuring the solder joint fillet height falls within the recommended range for reliable reflow bonding. For automated SMT assembly of this 44-position 0.050-inch pitch socket, the T2 tail depth ensures adequate paste coverage on each of the 44 pads while preventing solder wicking up the contact shank, which can degrade contact spring force and increase contact resistance after soldering.
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