SFM-122-T2-LM-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-122-T2-LM-D-A-K is a 44-position dual-row high-reliability surface-mount socket strip with 0.050-inch (1.27 mm) pitch and low-mount (LM) profile for space-constrained designs. Features gold-plated contacts rated at 1 A per pin for stable high-density board-to-board interconnection.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 44
- Lifecycle
- ACTIVE
- Datasheet
- SFM-122-T2-LM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 44-position dual-row configuration at 0.050-inch (1.27 mm) pitch delivering high-density board-to-board connectivity
- Low-mount (LM) profile minimizes stack height for space-constrained mezzanine and module designs
- Gold-plated contacts with high-reliability construction supporting thousands of mating cycles
- 1 A per pin current rating suitable for mixed-signal and low-power distribution applications
Applications
The SFM-122-T2-LM-D-A-K is well-suited for compact mezzanine modules, FPGA daughter boards, and high-density signal routing in telecommunications and test equipment where minimizing stack height is critical. Its 44-position dual-row layout at 1.27 mm pitch enables efficient PCB use in constrained enclosures while the low-mount profile reduces the overall assembly height. The gold-plated contact finish ensures long-term reliability and low contact resistance across the connector's service life in precision instrumentation and embedded computing platforms.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the stack height advantage of the low-mount (LM) profile in the SFM-122-T2-LM-D-A-K for compact module designs?
The LM (low-mount) designation reduces the mated connector stack height compared to standard SFM series variants, typically achieving stack heights in the range of 5 mm to 8 mm. This compact profile is valuable in chassis-constrained assemblies such as embedded computing blades and RF mezzanine modules where vertical clearance is limited to under 10 mm.
How does the 44-position SFM-122-T2-LM-D-A-K compare to the 52-position SFM-126 for FPGA expansion boards?
The SFM-122-T2-LM-D-A-K provides 44 positions (22 per row) versus 52 in the SFM-126, saving approximately 15% of board footprint at the same 0.050-inch (1.27 mm) pitch. FPGA expansion boards with fewer than 44 I/O channels benefit from the smaller form factor, while designs needing more signal lines step up to the 52-position variant without changing pitch or connector family.
What current per pin does the SFM-122-T2-LM-D-A-K support, and what contact plating does it use?
Each of the 44 pins supports up to 1 A of continuous current, totaling 44 A capacity across all positions. The gold-plated contacts provide low contact resistance, typically below 20 milliohms, and resist oxidation over thousands of mating cycles, making the connector reliable for high-speed differential signal pairs and low-noise analog lines.
Is the SFM-122-T2-LM-D-A-K available in tape-and-reel format for automated SMT assembly?
The SFM-122-T2-LM-D-A-K does not carry the -TR suffix, indicating it is available in tray or bulk packaging rather than tape-and-reel. Designers planning high-volume automated production should confirm packaging availability with SAMTEC or source the equivalent -TR variant; the 0.050-inch (1.27 mm) pitch surface-mount footprint is still compatible with pick-and-place equipment when supplied in tray format.
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