SFM-122-T2-L-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-122-T2-L-D-A-P-TR is a 44-position dual-row high-reliability surface-mount socket strip with 0.050 inch pitch, low-profile mount, gold-plated contacts, and tape-and-reel packaging. From $4.50 in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 44
- Lifecycle
- ACTIVE
- Datasheet
- SFM-122-T2-L-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-122-T2-L-D-A-P-TR?
- 44-position dual-row SMT socket at 0.050 inch (1.27 mm) pitch with low-profile (L) mount for reduced board stacking height in compact embedded system designs
- Gold-plated (A suffix) contacts with contact resistance below 20 mΩ ensuring stable high-speed signal performance over 500+ mating cycles
- Tape-and-reel (TR) packaging for automated pick-and-place SMT assembly with reflow soldering compatibility up to 260°C peak temperature
What is SFM-122-T2-L-D-A-P-TR used for?
The SAMTEC SFM-122-T2-L-D-A-P-TR is well suited for low-profile mezzanine board stacking, FPGA expansion modules, and compact embedded processor carrier boards that require 44 signal connections at 0.050 inch pitch with minimal vertical clearance. Its gold-plated dual-row contact design supports high-speed differential pairs and parallel data buses in telecommunications, industrial automation, and medical device PCB assemblies. The tape-and-reel packaging enables efficient high-volume automated SMT production.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-122-T2-L-D-A-P-TR datasheet?
SFM-122-T2-L-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-122-T2-L-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the low-profile (L) mount suffix affect the board clearance of the SFM-122-T2-L-D-A-P-TR compared to the standard-height SFM-122-T2-F-D-A-P-TR?
The SFM-122-T2-L-D-A-P-TR with the L (low-profile) mount suffix provides a reduced stand-off height of approximately 1 mm to 2 mm less than the standard F-mount SFM-122-T2-F-D-A-P-TR at the same 0.050 inch (1.27 mm) pitch. This difference is significant in thin embedded module designs where the total PCB stack must stay below 5 mm, such as in ruggedized IoT gateways or handheld medical instruments.
How many differential pairs can be routed through the 44-position SFM-122-T2-L-D-A-P-TR?
The SFM-122-T2-L-D-A-P-TR provides 44 positions at 0.050 inch (1.27 mm) pitch in a dual-row layout, supporting up to 22 differential signal pairs when adjacent contacts are paired. This capacity is sufficient for LVDS display interfaces, 2 lanes of USB 3.0 differential signals at 5 Gbps per lane, or mixed configurations of data lines and power rails in compact FPGA daughter board designs.
What production yield advantage does the SFM-122-T2-L-D-A-P-TR tape-and-reel packaging provide in SMT assembly?
The TR (tape-and-reel) packaging of the SFM-122-T2-L-D-A-P-TR enables continuous automated pick-and-place placement with position accuracy typically within ±0.05 mm, compared to loose-pack connectors that require manual or semi-automated handling. For production runs of 1000 or more boards, tape-and-reel eliminates manual placement variation across all 44 positions, improving first-pass solder joint yield in high-volume SMT lines using lead-free reflow at 260°C peak.
How does the gold contact finish on the SFM-122-T2-L-D-A-P-TR affect procurement cost versus tin-plated alternatives?
Gold-plated (A suffix) contacts on the SFM-122-T2-L-D-A-P-TR typically carry a 20% to 50% unit price premium over tin-plated equivalents, but provide substantially better performance in applications with more than 100 mating cycles or in environments with humidity above 85% RH. For designs requiring under 20 mating cycles over product lifetime, a tin-plated SFM variant may offer lower procurement cost without sacrificing contact resistance specifications below 50 mΩ.
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