SFM-121-T2-SM-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-121-T2-SM-D-A-K is a 42-position, dual-row, high-reliability socket strip with 0.050" (1.27 mm) pitch and surface mount termination. Features gold-plated contacts for low-resistance mating in high-density SMT board-to-board and mezzanine connector applications. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 42
- Lifecycle
- ACTIVE
- Datasheet
- SFM-121-T2-SM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 42 positions in dual-row 0.050" (1.27 mm) pitch SMT socket configuration for high-density board-to-board mating
- High-reliability design with gold-plated contacts (-K) rated for extended mating cycles in mission-critical applications
- Surface mount termination eliminates through-hole drilling and supports high-density double-sided PCB assembly
- Compatible with SAMTEC TSM and TSW series 0.050" pitch header pins for proven board stack-up interconnect systems
Applications
The SFM-121-T2-SM-D-A-K is used in high-density mezzanine board stack-up systems, FPGA daughter card interfaces, and backplane interconnects requiring 42-position dual-row socket connectivity at 0.050" pitch. Its high-reliability gold contacts make it suitable for aerospace, defense, medical, and industrial applications where connector longevity and low contact resistance are critical. The surface mount form factor integrates seamlessly into automated SMT production lines for compact embedded computing modules.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count does the SFM-121-T2-SM-D-A-K offer for high-density mezzanine designs?
The SFM-121-T2-SM-D-A-K provides 42 total positions in a dual-row socket configuration at 0.050" (1.27 mm) pitch, with 21 contacts per row. This high-density layout enables 42 signal or power connections in a PCB footprint significantly smaller than equivalent 2.54 mm pitch connectors, making it ideal for space-constrained mezzanine and daughter card stack-up designs.
How does the SFM-121-T2-SM-D-A-K's gold contact plating benefit high-reliability interconnect applications?
The -K suffix specifies gold-plated contacts, which maintain contact resistance below 20 mΩ across thousands of mating cycles and resist oxidation in humid or corrosive environments. Gold plating is specified for high-reliability applications in aerospace, defense, and medical equipment where connector failure is not acceptable, ensuring consistent signal integrity over the product's full service life.
What header pin series is the SFM-121-T2-SM-D-A-K designed to mate with for board stack-up systems?
The SFM-121-T2-SM-D-A-K is designed to mate with SAMTEC TSM and TSW series 0.050" pitch dual-row header strips. This proven mating system supports board stack heights from 8 mm to over 20 mm depending on the selected header, enabling flexible mezzanine board spacing in multi-board stack-up designs with 42 reliable signal connections.
What assembly process is required for the SFM-121-T2-SM-D-A-K and how does the surface mount format reduce production cost?
The SFM-121-T2-SM-D-A-K uses surface mount termination compatible with standard reflow soldering processes at peak temperatures up to 260°C. Eliminating through-hole drilling for 42 positions reduces PCB fabrication cost and enables automated pick-and-place assembly, which lowers placement cycle time and labor cost compared to manually loaded through-hole socket connectors in equivalent pin-count configurations.
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