SFM-121-T2-L-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-121-T2-L-D-A-K-TR is a 42-position dual-row surface mount socket strip with 0.050" (1.27 mm) pitch, designed for high-reliability board-to-board interconnect applications. It features a rugged housing and gold-plated contacts for superior signal integrity. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 42
- Lifecycle
- ACTIVE
- Datasheet
- SFM-121-T2-L-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 42-position dual-row configuration with 0.050" (1.27 mm) pitch for high-density board-to-board connections
- Surface mount termination style enables automated pick-and-place assembly with excellent coplanarity
- Gold-plated contacts ensure low contact resistance and high-reliability signal integrity in demanding environments
Applications
The SFM-121-T2-L-D-A-K-TR is widely used in high-density PCB stacking applications such as embedded computing modules, FPGA development boards, and industrial control backplanes. Its 0.050-inch pitch dual-row format makes it suitable for compact RF, telecom, and test-and-measurement equipment where space is at a premium. The surface mount design supports reliable automated assembly in high-volume production environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and row configuration does the SFM-121-T2-L-D-A-K-TR use?
The SFM-121-T2-L-D-A-K-TR uses a 0.050-inch (1.27 mm) pitch in a dual-row configuration with 42 total positions, providing high-density interconnect capability in a compact surface mount footprint.
Which PCB assembly processes are compatible with the SFM-121-T2-L-D-A-K-TR?
The SFM-121-T2-L-D-A-K-TR is designed for surface mount technology (SMT), making it compatible with standard reflow soldering processes. Its 1.27 mm pitch footprint supports automated pick-and-place equipment, enabling efficient high-volume manufacturing on standard PCB production lines.
When is SFM-121-T2-L-D-A-K-TR preferred over through-hole socket strips in board stacking designs?
The SFM-121-T2-L-D-A-K-TR is preferred in designs requiring SMT assembly on thin PCBs where through-hole drilling is not feasible. With 42 positions at 0.050-inch pitch, it saves significant board space compared to 2.54 mm pitch alternatives, making it ideal for compact multi-layer stacked module architectures.
What contact plating does the SFM-121-T2-L-D-A-K-TR feature for signal integrity?
The SFM-121-T2-L-D-A-K-TR features gold-plated contacts, which provide low and stable contact resistance across thousands of mating cycles. This plating is critical in high-reliability applications such as telecom, aerospace, and industrial control where consistent 50-ohm or sub-ohm signal paths are required.
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