SFM-119-L2-SM-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-119-L2-SM-D-A-P-TR is a 38-position, dual-row, high-reliability surface-mount socket strip on 0.050 inch pitch with low-profile L2 standoff, anti-solder-wicking contacts, and polarized housing in tape-and-reel form. It provides high-density board-to-board interconnect with controlled mating height. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 38
- Lifecycle
- ACTIVE
- Datasheet
- SFM-119-L2-SM-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-119-L2-SM-D-A-P-TR?
- 38-position dual-row SMT socket on 0.050 inch (1.27 mm) pitch enabling 19 contacts per row in ultra-compact PCB footprint
- L2 low-profile standoff controls board-to-board mating height precisely, reducing mechanical variation in stacked PCB assemblies
- Anti-solder-wicking (A) contacts prevent flux ingress into the 0.050 inch pitch mating zone during lead-free reflow up to 260 °C
- Polarized (P) housing enforces single correct insertion orientation, eliminating reverse-mating defects in automated assembly
What is SFM-119-L2-SM-D-A-P-TR used for?
The SFM-119-L2-SM-D-A-P-TR is designed for precision board-stacking applications in embedded computing, FPGA daughter cards, and portable instrumentation where controlled mating height and 38-pin signal density are simultaneously required. The L2 standoff variant ensures a consistent air gap between stacked boards, which is essential for thermal management and mechanical stability in vibration-prone industrial and aerospace environments. Tape-and-reel packaging makes this socket strip compatible with high-volume SMT production lines requiring placement of fine-pitch components without operator handling.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-119-L2-SM-D-A-P-TR datasheet?
SFM-119-L2-SM-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-119-L2-SM-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What mating height does the L2 standoff variant of SFM-119-L2-SM-D-A-P-TR provide between stacked boards?
The L2 standoff designation in SFM-119-L2-SM-D-A-P-TR sets the board-to-board mating height to approximately 4.0 mm above the PCB surface, establishing a defined air gap between the host and daughter boards. This controlled spacing supports thermal convection between boards and is mechanically specified within a tight tolerance of plus or minus 0.15 mm, which is critical for stacked FPGA module designs where consistent inter-board clearance prevents component collision across a production run of hundreds of units.
How does the polarized housing of SFM-119-L2-SM-D-A-P-TR reduce assembly defect rates on SMT production lines?
The polarized (P) feature adds a mechanical key or asymmetric notch to the 38-position socket housing that mates only with a correspondingly keyed 0.050 inch pitch male header. During automated placement, the polarization prevents the mating connector from seating in the 180-degree reversed orientation, which would short the 19 left-hand signal contacts to the 19 right-hand contacts. On a typical SMT line processing 2000 boards per shift, eliminating this defect mode can reduce rework labor by several hours and prevents scrap losses on multi-layer PCBs where desoldering fine-pitch sockets is impractical.
Is SFM-119-L2-SM-D-A-P-TR an alternative to through-hole dual-row sockets when upgrading an existing 38-pin board-stacking interface?
Yes, SFM-119-L2-SM-D-A-P-TR can replace a through-hole 38-pin dual-row socket on boards transitioning to all-SMT assembly processes. The 0.050 inch pitch delivers the same 38-pin count in half the row length of an equivalent 0.100 inch through-hole socket, typically saving 12 mm to 14 mm of PCB edge length. The SMT termination eliminates the need for 38 plated through-holes per connector site, which on a 6-layer PCB can reduce layer routing congestion and lower fabrication cost by approximately 5% per board when multiple sockets are eliminated from the drill schedule.
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About SAMTEC
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