SFM-119-02-H-D-LC SAMTEC Connector (Other) In Stock
SAMTEC SFM-119-02-H-D-LC is a 38-position dual-row high-reliability socket strip on 1.27 mm (0.050 inch) pitch with surface mount termination and low-crosstalk LC contacts. Provides high-density mezzanine connectivity with tall H-height standoff for component clearance. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 38
- Lifecycle
- ACTIVE
- Datasheet
- SFM-119-02-H-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-119-02-H-D-LC?
- 38-position dual-row socket on 1.27 mm (0.050 inch) pitch delivering high pin density in a compact SMT footprint
- LC (low crosstalk) contact system reduces capacitive coupling between adjacent signal pins for reliable high-speed data transmission
- H-height body option provides additional vertical clearance between stacked boards to accommodate tall components on mating PCBs
What is SFM-119-02-H-D-LC used for?
The SFM-119-02-H-D-LC addresses high-density mezzanine stacking in FPGA daughter boards, high-speed signal routing modules, and compact embedded computing platforms where 38 positions at 1.27 mm pitch are required. The LC contact variant ensures low crosstalk performance critical for parallel data buses and differential signal pairs operating at elevated frequencies. The tall H standoff height accommodates through-hole or tall SMT components between the host and daughter boards, enabling modular system designs with mixed component heights.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-119-02-H-D-LC datasheet?
SFM-119-02-H-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-119-02-H-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the H-height designation mean for the SFM-119-02-H-D-LC and when is it needed?
The H suffix designates a taller body height compared to the standard SFM variant, increasing the stack height between mated PCBs. This additional clearance of several millimeters accommodates taller components such as inductors, large capacitors, or through-hole connectors placed between the host and daughter boards in a 38-position 1.27 mm pitch mezzanine stack, preventing mechanical interference during assembly.
How does the SFM-119-02-H-D-LC LC contact system improve signal integrity in high-speed designs?
The LC (low crosstalk) contact geometry minimizes capacitive and inductive coupling between adjacent contacts on the 1.27 mm pitch, reducing noise injection between signal pairs. This is particularly important in 38-position connectors where multiple high-speed lanes run in parallel, such as LVDS display interfaces, DDR memory buses operating above 800 MHz, or multi-lane SERDES signals routed through FPGA mezzanine daughter cards.
Which procurement factors should engineers consider when specifying the SFM-119-02-H-D-LC for a new design?
Engineers should verify that the 1.27 mm pitch SMT footprint with 38 positions aligns with PCB routing capabilities and land pattern requirements. The non-tape-and-reel packaging (no TR suffix) means parts are supplied in trays or strips, so assembly quantities and pick-and-place feeder compatibility should be confirmed with the contract manufacturer. Availability in authorized SAMTEC stocking distributors ensures access to genuine parts with full traceability for production volumes requiring consistent quality and 1.27 mm pitch dimensional tolerances.
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About SAMTEC
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