SFM-118-T2-FM-D-LC SAMTEC Connector (Other) In Stock
SAMTEC SFM-118-T2-FM-D-LC is a 36-position dual-row high-reliability surface-mount socket strip at 0.050-inch pitch with low-clearance contacts and flush-mount termination, designed for compact high-speed board-to-board interconnects in modular embedded systems.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 36
- Lifecycle
- ACTIVE
- Datasheet
- SFM-118-T2-FM-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-118-T2-FM-D-LC?
- 36 positions in dual-row configuration at 0.050" (1.27 mm) pitch for compact board-to-board mating
- Low-clearance (LC) contact geometry minimizes mated stack height for slim assemblies
- Flush-mount (FM) surface-mount termination enables low-profile reflow-soldered installation
- T2 contact style provides enhanced retention force for reliable high-speed signal integrity
- High reliability socket design suitable for frequent module insertion and removal cycles
What is SFM-118-T2-FM-D-LC used for?
The SFM-118-T2-FM-D-LC suits compact sensor interface boards, high-speed mezzanine modules, and portable test equipment where 36 contacts at 0.050-inch pitch maximize signal density in a minimal footprint. The low-clearance design keeps the board-to-board gap minimal, enabling slim enclosures in industrial handheld devices and embedded computing platforms. The flush-mount termination supports standard reflow soldering processes used across SMT production lines.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-118-T2-FM-D-LC datasheet?
SFM-118-T2-FM-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-118-T2-FM-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the contact count and pitch of SFM-118-T2-FM-D-LC for mezzanine module designs?
The SFM-118-T2-FM-D-LC provides 36 positions in a dual-row layout at 0.050-inch (1.27 mm) pitch, suitable for routing combined SPI, I2C, and GPIO signals plus power rails on a compact mezzanine module without requiring multiple smaller connectors spread across the PCB.
How does the T2 contact style on SFM-118-T2-FM-D-LC affect signal integrity in high-speed designs?
The T2 contact designation in SAMTEC's SFM series indicates an enhanced contact geometry with increased normal force, maintaining lower and more consistent contact resistance across 36 positions. This improves signal integrity for high-speed differential pairs and reduces intermittent contact failures in vibration-prone industrial and mobile embedded applications.
For a portable diagnostic instrument, why is the low-clearance (LC) feature of SFM-118-T2-FM-D-LC beneficial?
The LC low-clearance contact design reduces the physical gap between mated PCBs to several millimeters, enabling thinner instrument enclosures. In handheld diagnostic tools and portable test equipment where total device thickness must stay under 20 mm, the LC geometry directly contributes to achieving mechanical size and weight targets without sacrificing 36-contact interconnect capacity.
How does the 36-position SFM-118-T2-FM-D-LC compare to the 40-position SFM-120 when routing USB 3.0 super-speed signals?
For USB 3.0 SuperSpeed at 5 Gbps, both 36- and 40-position SFM variants at 0.050-inch pitch accommodate the required differential pairs with adequate ground pins nearby. The SFM-118-T2-FM-D-LC's 36 contacts are sufficient for a USB 3.0 interface plus auxiliary signals, while the extra 4 positions in the SFM-120 provide margin for additional power or control lines if the design later expands.
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