SFM-118-02-ZZ-D-A-K-TR SAMTEC Connector (Other) In Stock
The SFM-118-02-ZZ-D-A-K-TR is a Samtec 36-position dual-row high-reliability surface-mount socket strip with 0.050 inch pitch, designed for dense board-to-board interconnects. It features SMT termination and tape-and-reel packaging for automated assembly. Available with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 36
- Lifecycle
- ACTIVE
- Datasheet
- SFM-118-02-ZZ-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 36-position dual-row socket strip with 0.050 inch pitch for high-density board-to-board connections
- High-reliability contact design rated for repeated mating cycles in demanding environments
- Surface-mount termination compatible with standard SMT reflow assembly processes
- Tape-and-reel (TR) packaging enabling automated pick-and-place production
Applications
The SFM-118-02-ZZ-D-A-K-TR is suited for high-density board-to-board interconnects in compact embedded systems, FPGA mezzanine cards, and telecommunications equipment. Its 36-position dual-row layout at 0.050 inch pitch allows routing of power and signal in a minimal PCB footprint. The SMT format and tape-and-reel packaging support efficient automated assembly in volume production.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the SFM-118-02-ZZ-D-A-K-TR provide, and what pitch does it use?
The SFM-118-02-ZZ-D-A-K-TR provides 36 positions arranged in a dual-row configuration at 0.050 inch (1.27 mm) pitch, enabling high-density interconnection on compact PCB designs such as mezzanine cards, FPGA modules, and embedded computing boards.
What assembly method does the SFM-118-02-ZZ-D-A-K-TR support, and how is it packaged for production?
It uses surface-mount technology (SMT) termination, compatible with standard reflow soldering processes, and is packaged in tape-and-reel (TR) format for automated pick-and-place assembly. This makes it suitable for high-volume manufacturing requiring consistent placement accuracy.
In which high-reliability embedded applications is the SFM-118-02-ZZ-D-A-K-TR commonly used?
This connector is used in FPGA mezzanine cards, industrial SBC modules, and telecommunications line cards where 36-position dual-row SMT sockets at 0.050 inch pitch provide reliable signal and power routing. Its high-reliability contact construction tolerates repeated mating cycles over the product lifetime.
How does the 0.050 inch pitch of SFM-118-02-ZZ-D-A-K-TR compare to standard 0.1 inch pitch connectors for PCB space savings?
At 0.050 inch (1.27 mm) pitch versus the standard 0.1 inch (2.54 mm) pitch, the SFM-118-02-ZZ-D-A-K-TR occupies roughly half the board length for the same 36 positions, making it valuable in space-constrained designs where high contact density and compact SMT footprint are both required.
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