SFM-117-T2-ZZ-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-117-T2-ZZ-D-A-K-TR is a 34-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch in a surface-mount package, engineered for compact mezzanine board-to-board interconnections in computing and telecommunications equipment. Features gold-plated contacts, controlled impedance, and tape-and-reel packaging for automated SMT assembly. Competitively priced and available from SAMTEC authorized global distributors.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 34
- Lifecycle
- ACTIVE
- Datasheet
- SFM-117-T2-ZZ-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 34-position dual-row format at 0.050" (1.27 mm) pitch enables high-density board-to-board mezzanine connections in compact PCB designs
- Gold-plated contacts ensure low contact resistance and long-life reliability across repeated mating and unmating cycles
- Surface-mount termination with controlled impedance supports high-speed signal integrity in data communications applications
- Tape-and-reel (TR) packaging compatible with automated pick-and-place SMT equipment for high-volume production efficiency
Applications
The SFM-117-T2-ZZ-D-A-K-TR is well-suited for mezzanine daughter-card connections in blade servers, telecommunications line cards, and FPGA evaluation boards requiring 34 contacts at 0.050" pitch with surface-mount reliability. Its high-reliability contact design and 1.27 mm pitch make it an excellent choice for high-speed digital interfaces in network switching equipment and embedded computing modules where signal density and long-term performance are critical. The tape-and-reel packaging ensures efficient automated SMT assembly for production-scale telecommunications and industrial electronics manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pin arrangement of the SFM-117-T2-ZZ-D-A-K-TR and how does it fit mezzanine designs?
The SFM-117-T2-ZZ-D-A-K-TR has 34 positions arranged in a dual-row layout with 17 pins per row at 0.050" (1.27 mm) pitch. This configuration is standard for SAMTEC SFM-series mezzanine stacking systems, providing a compact high-pin-count surface-mount footprint for daughter-card interconnections in blade server and telecom line-card assemblies.
How does the 0.050" pitch of the SFM-117-T2-ZZ-D-A-K-TR help with signal routing density compared to 0.100" pitch connectors?
At 0.050" (1.27 mm) pitch, the SFM-117-T2-ZZ-D-A-K-TR routes 34 contacts in approximately the same board length needed for 17 contacts at 0.100" pitch. This halved pitch doubles the signal count per unit PCB edge length, which is critical in high-density computing and communications boards where available connector footprint space is limited.
Is the SFM-117-T2-ZZ-D-A-K-TR compatible with automated SMT production lines?
Yes, the TR suffix confirms tape-and-reel packaging that is fully compatible with automated pick-and-place equipment. The surface-mount termination of this 34-position, 0.050" pitch SAMTEC socket strip supports standard reflow solder profiles, making it appropriate for high-volume SMT manufacturing in telecommunications, computing, and industrial electronics production facilities.
What contact plating does the SFM-117-T2-ZZ-D-A-K-TR use and why does it matter for reliability?
The SFM-117-T2-ZZ-D-A-K-TR uses gold-plated contacts, which provide a contact resistance typically below 20 milliohms and resist oxidation for the lifetime of the connector. Gold plating is especially important in mezzanine board-to-board applications where 34 contacts must maintain consistent low-resistance connections across multiple mating cycles in telecommunications and computing equipment.
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