SFM-117-T2-STL-D SAMTEC Connector (Other) In Stock
SFM-117-T2-STL-D is a 34-position dual-row high-reliability surface-mount socket strip from SAMTEC with 1.27 mm (0.050 inch) pitch, designed for dense board-to-board and mezzanine signal interconnects. Features gold-plated contacts for corrosion resistance and reliable mating. In stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 34
- Lifecycle
- ACTIVE
- Datasheet
- SFM-117-T2-STL-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-117-T2-STL-D?
- 34-position dual-row layout at 1.27 mm (0.050 inch) pitch delivers 34 signal connections in a compact SMT footprint
- High-reliability socket strip design ensures repeatable mating force and low contact resistance across hundreds of insertion cycles
- Surface-mount termination enables reflow soldering with other SMD components, reducing assembly complexity and board fabrication cost
What is SFM-117-T2-STL-D used for?
SFM-117-T2-STL-D is used in FPGA mezzanine modules, high-density test fixtures, and embedded computing boards where a 34-position dual-row SMT socket at 0.050 inch pitch is needed for reliable board-to-board signal routing. Its high-reliability contact system suits aerospace, defense, and medical equipment requiring consistent connectivity under vibration and thermal cycling. The connector is also applied in data acquisition systems and modular instrument platforms that demand dense, low-profile mezzanine interconnects.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-117-T2-STL-D datasheet?
SFM-117-T2-STL-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-117-T2-STL-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signals can SFM-117-T2-STL-D carry, and what pitch does it use?
SFM-117-T2-STL-D provides 34 positions arranged in 2 rows at 1.27 mm (0.050 inch) pitch, delivering 34 independent signal or power contacts in a compact surface-mount footprint. The 1.27 mm pitch doubles density compared to 2.54 mm pitch connectors, enabling dense board-to-board interconnects in space-constrained PCB designs.
For a mezzanine module design, how does SFM-117-T2-STL-D's surface-mount style benefit the manufacturing process?
SFM-117-T2-STL-D's SMT termination allows it to be placed and reflowed alongside other surface-mount components in a single reflow pass, eliminating the additional wave-solder or hand-solder step required for through-hole connectors. This reduces manufacturing cycle time and solder defect risk for 34-position dual-row connectors on high-density mezzanine boards.
When is SFM-117-T2-STL-D a better fit than a 2.54 mm pitch 34-position dual-row connector for FPGA boards?
SFM-117-T2-STL-D at 1.27 mm (0.050 inch) pitch occupies roughly half the linear board length compared to a 2.54 mm pitch equivalent, saving approximately 22 mm of PCB edge for the same 34 contacts. On FPGA carrier boards and mezzanine cards constrained to standard FMC dimensions (69 mm x 76.5 mm), this space saving is essential for routing all required I/O signals within the footprint.
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About SAMTEC
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