SFM-117-T2-F-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-117-T2-F-D-A-K is a 34-position dual-row high-reliability surface mount socket strip with 0.050" pitch engineered for compact high-density board-to-board mating in demanding applications. It provides secure mechanical retention and fine-pitch signal integrity suitable for telecommunications, defense, and high-performance computing assemblies. Available in stock worldwide with competitive pricing and fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 34
- Lifecycle
- ACTIVE
- Datasheet
- SFM-117-T2-F-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 34-position dual-row surface mount socket at 0.050" pitch delivering fine-pitch high-density board-to-board connectivity
- High-reliability construction with secure mechanical retention for industrial, defense, and aerospace mezzanine applications
- SMT-compatible fine-pitch footprint enabling automated placement in high-volume PCB manufacturing of compact interconnect assemblies
Applications
The SFM-117-T2-F-D-A-K is designed for high-density mezzanine and daughter card applications in defense electronics, telecommunications line cards, and high-performance computing modules where 34 positions at 0.050" pitch are required in a compact surface mount configuration. Its robust socket construction ensures reliable mating integrity across thousands of connection cycles in environments subject to vibration, shock, and wide temperature variations.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count does the SFM-117-T2-F-D-A-K provide for mezzanine board stacking?
The SFM-117-T2-F-D-A-K offers 34 positions in a dual-row arrangement at a 0.050" (1.27 mm) pitch, making it suitable for fine-pitch mezzanine board-to-board stacking where high signal density is required in a minimal PCB footprint. This specification accommodates up to 34 independent signal or power connections per connector in defense, telecom, and computing mezzanine stack-up designs.
How does the SFM-117-T2-F-D-A-K perform across thermal cycling, and which environments is it rated for?
The SFM-117-T2-F-D-A-K is a SAMTEC high-reliability socket strip rated to perform across wide temperature ranges, typically from -55°C to +125°C, maintaining consistent contact force across 34 dual-row positions under repeated thermal cycling. This thermal stability is essential for defense avionics, industrial automation, and telecom equipment where board-to-board connectors must sustain thousands of thermal cycles without degradation in contact resistance or mechanical retention.
Which mating connectors pair with the SFM-117-T2-F-D-A-K for a dual-row 0.050" board-to-board stack?
The SFM-117-T2-F-D-A-K mates with SAMTEC TSM or SFM series dual-row 0.050" pitch terminal strip headers, providing a 34-position board-to-board interconnect with stacking heights typically available from 4 mm to 20 mm. Selecting the appropriate mating header from SAMTEC's SFM family allows designers to set the board separation distance precisely for the mechanical constraints of their mezzanine assembly.
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