SFM-117-L2-L-D-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-117-L2-L-D-K-TR is a 34-position dual-row high-reliability surface mount socket strip with 1.27 mm (0.050 inch) pitch, designed for high-density board-to-board mating. Features gold-flash contacts and tape-and-reel packaging. Available from stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 34
- Lifecycle
- ACTIVE
- Datasheet
- SFM-117-L2-L-D-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 34-position dual-row SMT socket strip with 1.27 mm (0.050") pitch for high-density board-to-board interconnects
- High reliability gold-flash mating contacts minimize contact resistance across repeated mating cycles
- Tape-and-reel (-TR) packaging enables automated pick-and-place assembly for high-volume production
Applications
The SFM-117-L2-L-D-K-TR is used in high-density board-to-board stacking applications such as mezzanine interconnects in embedded computing, telecom line cards, and industrial I/O expansion modules. Its 1.27 mm pitch and 34-position dual-row layout provide 68 signal contacts in a minimal PCB footprint. Tape-and-reel packaging makes it practical for automated SMT assembly in volume production.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many total contacts does SFM-117-L2-L-D-K-TR provide, and what is its mating pitch?
The SFM-117-L2-L-D-K-TR provides 34 positions in a dual-row configuration, yielding 68 total contacts at a 1.27 mm (0.050 inch) pitch. This density makes it well suited for high-bandwidth board-to-board mezzanine stacking applications in embedded and telecom systems.
What board-to-board applications are best served by the SFM-117-L2-L-D-K-TR socket strip?
The SFM-117-L2-L-D-K-TR is ideal for mezzanine card interconnects, FPGA daughterboard stacking, and I/O expansion modules where 68 contacts at 1.27 mm pitch are needed. Its surface mount profile and dual-row layout minimize board space while delivering high signal density for data-intensive designs.
Does the -TR suffix on SFM-117-L2-L-D-K-TR indicate a specific packaging format for automated assembly?
Yes, the -TR suffix designates tape-and-reel packaging, allowing the 68-contact SMT socket strip to be placed by automated pick-and-place equipment. This packaging supports high-volume production runs and reduces manual handling, improving placement consistency for the 1.27 mm pitch footprint.
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