SFM-117-02-H-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-117-02-H-D-A-P-TR is a 34-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch, tall stack height, anti-backout retention, and surface mount termination. It offers high-contact-density board-to-board connectivity with tape-and-reel packaging for automated assembly. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 34
- Lifecycle
- ACTIVE
- Datasheet
- SFM-117-02-H-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-117-02-H-D-A-P-TR?
- 34-position dual-row socket on 0.050" (1.27 mm) pitch enabling 34 high-density contacts in a minimal board footprint
- High-reliability contact system designed for hundreds of insertion cycles with stable sub-milliohm contact resistance
- Tall (H) stack height providing clearance for components mounted between two stacked PCBs
- Anti-backout (A) retention preventing unintentional mating disengagement under vibration and mechanical stress
What is SFM-117-02-H-D-A-P-TR used for?
The SFM-117-02-H-D-A-P-TR is suited for compact mezzanine and module interconnects in embedded computing, FPGA daughterboards, and medical device electronics requiring 34-pin dual-row socket connectivity at 1.27 mm pitch with tall board clearance. The anti-backout retention and high-reliability contacts make it dependable in industrial and defense systems exposed to vibration. Tape-and-reel packaging supports seamless integration into automated SMT reflow production lines.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-117-02-H-D-A-P-TR datasheet?
SFM-117-02-H-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-117-02-H-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How are the 34 positions distributed in the SFM-117-02-H-D-A-P-TR, and what pitch separates adjacent contacts?
The SFM-117-02-H-D-A-P-TR arranges its 34 positions in a dual-row layout with 17 contacts per row at a 0.050" (1.27 mm) center-to-center pitch in both row and column directions. This configuration delivers 34 simultaneous connections in roughly half the PCB footprint of an equivalent 0.100" pitch dual-row connector, benefiting space-constrained board designs.
Why would a designer specify the tall (H) height option in the SFM-117-02-H-D-A-P-TR for a stacked PCB assembly?
The tall H height option provides additional vertical clearance between the mated boards, accommodating components such as tall electrolytic capacitors, inductors, or heat spreaders mounted on the lower PCB that would otherwise interfere with the upper board at a standard stack height. This clearance—typically several millimeters taller than the standard variant—allows more flexible component placement across all 34 connection paths without modifying board separation.
In an embedded computing module subject to transportation shock, how does the anti-backout (A) feature of the SFM-117-02-H-D-A-P-TR prevent signal loss?
The anti-backout retention mechanism applies a spring or latch force opposing axial pull-out of the mating header, keeping all 34 contacts engaged under shock loads that can reach tens of g during shipping or field deployment. Without this feature, high-pin-count connectors at 1.27 mm pitch are susceptible to partial withdrawal where even one pin losing contact can corrupt bus signals, causing system crashes or data corruption in storage and network modules.
Can the SFM-117-02-H-D-A-P-TR support lead-free reflow soldering, and does the tape-and-reel packaging aid automated assembly?
Yes, the SFM-117-02-H-D-A-P-TR SMT termination is compatible with lead-free reflow at peak temperatures up to 260°C per JEDEC J-STD-020 guidelines. The TR tape-and-reel packaging feeds into automated pick-and-place equipment at placement rates suited for high-volume lines, with component orientation maintained on the reel for placement accuracy within ±0.05 mm across all 34 SMT pads.
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