SFM-116-T2-LM-D-LC-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-116-T2-LM-D-LC-TR is a 32-position dual-row high-reliability surface-mount socket strip with 0.050 inch pitch, low-profile mount, and tape-and-reel packaging for automated SMT assembly. From $3.50 in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 32
- Lifecycle
- ACTIVE
- Datasheet
- SFM-116-T2-LM-D-LC-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-116-T2-LM-D-LC-TR?
- 32-position dual-row SMT socket at 0.050 inch (1.27 mm) pitch with low-profile (LM) mount minimizing board stack height in space-constrained designs
- High-reliability contact design supporting 500+ mating cycles with low contact resistance for stable signal integrity in demanding environments
- Tape-and-reel (TR) packaging enabling high-throughput automated pick-and-place SMT assembly with reflow compatibility up to 260°C
What is SFM-116-T2-LM-D-LC-TR used for?
The SAMTEC SFM-116-T2-LM-D-LC-TR low-profile surface-mount socket is well suited for compact mezzanine board stacking, processor module interconnects, and portable instrument designs where minimizing vertical height is critical at 0.050 inch pitch with 32 positions. Its dual-row layout supports 16-bit parallel buses, mixed power-and-signal routing, and high-speed differential pairs in embedded systems. The tape-and-reel format supports automated SMT production for telecommunications, medical device, and industrial control board assemblies.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-116-T2-LM-D-LC-TR datasheet?
SFM-116-T2-LM-D-LC-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-116-T2-LM-D-LC-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What makes the SFM-116-T2-LM-D-LC-TR suitable for height-critical board stacking applications?
The SFM-116-T2-LM-D-LC-TR features a low-profile mount (LM suffix) that reduces the overall board stacking height compared to standard-height SFM variants. At 0.050 inch (1.27 mm) pitch with 32 dual-row positions, it maintains a compact vertical footprint while providing 32 signal connections, making it ideal for thin embedded modules where the mezzanine stack height must stay under 5 mm.
How many differential signal pairs can be routed through the SFM-116-T2-LM-D-LC-TR?
The SFM-116-T2-LM-D-LC-TR provides 32 positions total (16 per row) at 0.050 inch (1.27 mm) pitch, supporting up to 16 differential signal pairs when adjacent contacts are used as pair lanes. This capacity is sufficient for LVDS, MIPI, or USB 3.0 differential buses in FPGAs and DSP modules operating at data rates above 1 Gbps per pair.
What reflow soldering conditions apply to the SFM-116-T2-LM-D-LC-TR for SMT assembly?
The SFM-116-T2-LM-D-LC-TR is rated for SMT reflow soldering with a peak temperature of 260°C, compatible with standard SAC305 lead-free solder alloy per IPC/JEDEC J-STD-020. Tape-and-reel (TR) packaging ensures compatibility with automated pick-and-place equipment, enabling consistent placement accuracy across all 32 positions in high-volume SMT production lines.
How does the LC variant designation of the SFM-116-T2-LM-D-LC-TR affect its PCB footprint?
The LC suffix in SFM-116-T2-LM-D-LC-TR indicates a land configuration optimized for the surface-mount footprint, providing a specific pad layout designed for low-profile assembly with minimized solder-joint stress. At 0.050 inch (1.27 mm) pitch with 32 dual-row positions, the LC land configuration ensures proper solder fillet formation on all 32 pads, supporting pull strength ratings typically above 5 N per contact.
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