SFM-116-02-SM-D-LC SAMTEC Connector (Other) In Stock
Samtec SFM-116-02-SM-D-LC is a 32-position dual-row high-reliability surface mount socket strip with 0.050" (1.27 mm) pitch and low-crosstalk contacts, engineered for high-speed board-to-board mezzanine connections with superior signal integrity.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 32
- Lifecycle
- ACTIVE
- Datasheet
- SFM-116-02-SM-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-116-02-SM-D-LC?
- 32-position dual-row layout at 0.050" (1.27 mm) pitch delivers high-density mezzanine board-to-board connections
- Low-crosstalk (-LC) contact design reduces near-end and far-end crosstalk for high-speed serial data links
- High-reliability gold-plated contacts ensure low contact resistance and long mating cycle durability
- Surface mount termination supports automated reflow soldering for consistent assembly quality
What is SFM-116-02-SM-D-LC used for?
The SFM-116-02-SM-D-LC is well suited for high-speed board-to-board mezzanine interconnect in FPGA evaluation platforms, network processor daughtercards, and data acquisition modules where signal integrity above 1 Gbps is required. Its low-crosstalk contact design makes it a preferred choice for differential pair routing in SerDes and PCIe expansion board designs. The compact 0.050" pitch surface mount format enables tight PCB layouts in space-constrained embedded computing and communications hardware.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-116-02-SM-D-LC datasheet?
SFM-116-02-SM-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-116-02-SM-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the low-crosstalk (-LC) design of the SFM-116-02-SM-D-LC improve high-speed signal performance?
The low-crosstalk contact design in the SFM-116-02-SM-D-LC reduces electromagnetic coupling between adjacent signal pins in the 32-position dual-row connector, lowering near-end crosstalk (NEXT) and far-end crosstalk (FEXT) levels. This is critical for maintaining signal integrity on high-speed differential pairs operating at data rates above 1 Gbps, such as PCIe, USB 3.0, or multi-gigabit SerDes links in FPGA and network processor mezzanine designs.
What is the pin count and row arrangement of the SFM-116-02-SM-D-LC, and how does the pitch compare to standard connectors?
The SFM-116-02-SM-D-LC provides 32 positions in a dual-row arrangement with 16 contacts per row, all at a 0.050" (1.27 mm) pitch. This pitch is half that of standard 0.100" (2.54 mm) connectors, enabling nearly 4 times the connection density per unit length. The 32-position count fits applications needing more connections than a 28-pin variant but fewer than the 48-pin SFM-124 family members.
In which PCB design scenarios is the SFM-116-02-SM-D-LC a better choice than the SFM-114 variant?
The SFM-116-02-SM-D-LC with 32 positions is preferred over the 28-position SFM-114 when a design requires 4 additional signal lines — for example, when adding power or ground pairs alongside 28 data signals in a mezzanine board interface. Both share the same 0.050" pitch surface mount format, but the SFM-116 also includes the low-crosstalk (-LC) contact option, making it better suited for mixed power and high-speed signal applications exceeding 1 Gbps data rates.
What SMT assembly considerations apply to the SFM-116-02-SM-D-LC during PCB manufacturing?
The SFM-116-02-SM-D-LC uses surface mount termination compatible with standard SMT reflow soldering processes at peak temperatures up to 260°C per J-STD-020. All 32 dual-row contacts must maintain coplanarity within standard SMT tolerances to ensure reliable solder joint formation. The connector can be placed with automated pick-and-place equipment, and the 0.050" (1.27 mm) pitch requires precise solder paste printing with a fine-pitch stencil to prevent bridging between adjacent pads.
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