SFM-116-02-L-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-116-02-L-D-A-K is a 32-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch for surface mount applications. Offers gold-plated contacts and a low-profile surface mount design suited for dense high-density interconnects. Globally available from authorized SAMTEC distributors with fast worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 32
- Lifecycle
- ACTIVE
- Datasheet
- SFM-116-02-L-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 32-position dual-row 0.050" (1.27 mm) pitch socket strip enables high-density board stacking in space-constrained SMT designs
- High-reliability construction with gold-plated contacts ensures low contact resistance and long service life over thousands of mating cycles
- Surface mount footprint with low-profile body supports automated PCB assembly and compact electronic packaging requirements
Applications
The SFM-116-02-L-D-A-K is designed for high-density board-to-board stacking applications in FPGA mezzanine cards, RF transceiver modules, and compact embedded computing systems. The 0.050" pitch dual-row socket strip allows 32 signal or power connections within minimal PCB real estate, enabling modular system architectures with reliable mating. Its high-reliability gold contacts make it suitable for defense, aerospace, and industrial instrumentation where connection integrity over extended service life is critical.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 0.050" pitch of the SFM-116-02-L-D-A-K compare to standard 0.100" connectors for high-density PCB designs?
At 0.050" (1.27 mm) pitch, the SFM-116-02-L-D-A-K provides twice the connection density of standard 0.100" pitch connectors, allowing 32 positions to fit in the same board space that a standard pitch connector would use for 16. This halved pitch is essential for compact FPGA mezzanine, RF module, and processor-board designs where PCB area is the primary constraint.
What contact plating does the SFM-116-02-L-D-A-K use and how does it affect mating durability in mission-critical systems?
The SFM-116-02-L-D-A-K features gold-plated contacts, which provide substantially lower and more stable contact resistance compared to tin-plated alternatives. Gold plating resists oxidation over thousands of mating cycles and across temperature extremes, making this 32-position socket strip suitable for avionics, defense electronics, and industrial instrumentation where intermittent contact is not acceptable.
Can the SFM-116-02-L-D-A-K be used in FPGA mezzanine card (FMC) or similar modular board stacking architectures?
Yes. The SFM-116-02-L-D-A-K's 0.050" (1.27 mm) pitch and dual-row 32-position configuration align with high-density mezzanine interconnect standards used in FPGA development boards and FMC-compatible module designs. Its SMT mounting provides structural integrity during board insertion and removal cycles typical of modular embedded computing platforms.
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