SFM-115-T2-ZZ-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-115-T2-ZZ-D-A-K-TR is a 30-position dual-row high-reliability surface-mount socket strip with 0.050" (1.27 mm) pitch, gold-plated contacts rated at 1 A per pin, and tape-and-reel packaging for automated SMT assembly. It operates from -55°C to +125°C and is suited to high-density mezzanine and board-to-board interconnect designs. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 30
- Lifecycle
- ACTIVE
- Datasheet
- SFM-115-T2-ZZ-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-115-T2-ZZ-D-A-K-TR?
- 30-position dual-row configuration on 0.050" (1.27 mm) pitch for high-density signal interconnect within a minimal PCB footprint
- Gold-plated contacts rated at 1 A per pin providing low contact resistance and extended corrosion resistance
- Tape-and-reel (TR) packaging enabling automated SMT pick-and-place assembly for high-volume production runs
- High-reliability design rated for -55°C to +125°C operating temperature range supporting industrial and aerospace applications
What is SFM-115-T2-ZZ-D-A-K-TR used for?
The SFM-115-T2-ZZ-D-A-K-TR is designed for high-density board-to-board and mezzanine interconnect applications in FPGA daughtercard systems, embedded computing modules, and telecommunications equipment requiring a compact 30-position dual-row 0.050" pitch socket. Its tape-and-reel format enables seamless integration into automated SMT assembly lines for consistent high-volume manufacturing. The -55°C to +125°C rating qualifies the connector for demanding industrial, defense, and aerospace environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-115-T2-ZZ-D-A-K-TR datasheet?
SFM-115-T2-ZZ-D-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-115-T2-ZZ-D-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the total current capacity of the SFM-115-T2-ZZ-D-A-K-TR across all 30 pins?
The SFM-115-T2-ZZ-D-A-K-TR provides 1 A per pin across all 30 positions, yielding a theoretical maximum of 30 A total. In practice, designers derate by 20-30% under continuous load conditions at elevated temperatures above 85°C, limiting reliable total current to approximately 21-24 A when the connector is used for mixed signal and power distribution in high-density board-to-board applications.
For a compact FPGA expansion module design, how does the 30-position 0.050" pitch socket compare to a 0.100" pitch alternative?
The SFM-115-T2-ZZ-D-A-K-TR on 0.050" (1.27 mm) pitch occupies approximately half the linear PCB length of a 30-position 0.100" (2.54 mm) pitch alternative, enabling a 30-pin interface within roughly 19 mm of connector length. This space saving is critical for compact FPGA mezzanine cards where PCB area is constrained and multiple high-density connectors must fit within a fixed board outline such as a PC/104 or custom 60×40 mm module.
What does the tape-and-reel packaging of the SFM-115-T2-ZZ-D-A-K-TR mean for high-volume PCB assembly?
The -TR suffix indicates the SFM-115-T2-ZZ-D-A-K-TR is supplied in EIA-481 standard tape-and-reel format, compatible with automated SMT pick-and-place equipment. This eliminates the manual component tray handling required for tray-packaged connectors, reducing placement cycle time and maintaining consistent placement accuracy within ±0.05 mm across high-volume production batches of 1000 or more PCBs.
Which SAMTEC header series mates with the SFM-115-T2-ZZ-D-A-K-TR, and what board separation heights are achievable?
The SFM-115-T2-ZZ-D-A-K-TR mates with SAMTEC TFM or SFM series male headers on the 0.050" (1.27 mm) dual-row pitch. Depending on the selected mating header variant, board-to-board stack heights from approximately 4 mm up to 20 mm are achievable, allowing designers to accommodate different component heights on the daughtercard and adjust airflow clearance in densely stacked embedded system enclosures.
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About SAMTEC
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