SFM-115-02-LM-D-A-K-TR SAMTEC Connector (Other) In Stock
The SFM-115-02-LM-D-A-K-TR is a 30-position dual-row high-reliability surface-mount socket strip from SAMTEC with 0.050 inch (1.27 mm) pitch. It provides secure mating for fine-pitch board-to-board and card-edge connections in space-constrained designs. Available in stock worldwide with competitive pricing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 30
- Lifecycle
- ACTIVE
- Datasheet
- SFM-115-02-LM-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 30-position dual-row configuration on 0.050 inch (1.27 mm) pitch delivers high pin density in minimal PCB footprint
- Surface-mount termination with tape-and-reel (TR) packaging supports automated pick-and-place assembly for high-volume production
- High-reliability socket strip construction with gold-plated contacts ensures consistent signal integrity across mating cycles
Applications
The SFM-115-02-LM-D-A-K-TR surface-mount socket strip is suited for high-density mezzanine and board-to-board interconnects in embedded computing, FPGA daughter cards, and communications modules where 0.050 inch pitch conserves precious board area. Its dual-row 30-position layout supports simultaneous power and signal routing in compact industrial control and test-and-measurement PCBs. The tape-and-reel packaging option enables automated SMT assembly in high-volume production environments such as telecom line cards and ruggedized military electronics.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the SFM-115-02-LM-D-A-K-TR provide and what is its contact pitch?
The SFM-115-02-LM-D-A-K-TR provides 30 positions arranged in a dual-row configuration on a 0.050 inch (1.27 mm) pitch. This fine pitch allows a high density of signal and power contacts within a compact SMT footprint, making it well suited for FPGA daughter card interfaces, mezzanine board stacking, and space-constrained embedded computing designs.
When should a designer choose the SFM-115-02-LM-D-A-K-TR over a standard 0.100 inch pitch header for a board-to-board connection?
The SFM-115-02-LM-D-A-K-TR on 0.050 inch pitch is preferred when PCB real estate is limited and a large number of signals must be routed across a board-to-board interface within a footprint roughly half the size of a 0.100 inch pitch connector. Applications such as rugged embedded modules, small-form-factor single-board computers, and high-channel-count data acquisition cards benefit from the 1.27 mm pitch to achieve 30-pin connectivity in minimal space.
Does the SFM-115-02-LM-D-A-K-TR come in tape-and-reel packaging and how does this affect assembly?
Yes, the -TR suffix confirms this connector ships in tape-and-reel packaging, enabling automated SMT pick-and-place assembly on standard surface-mount lines. This reduces manual handling of the 30-position dual-row components, improves placement accuracy on 0.050 inch pitch pads, and supports high-volume production runs in telecom, industrial, and defense electronics manufacturing where consistent solder joint quality across all 30 pins is required.
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