SFM-114-L2-ZZ-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-114-L2-ZZ-D-A-K-TR is a 28-position dual-row high-reliability socket strip with 0.050 inch pitch in a surface mount package, providing dense board-to-board connections for high-speed signal applications. Available in tape-and-reel format for automated SMD assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 28
- Lifecycle
- ACTIVE
- Datasheet
- SFM-114-L2-ZZ-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 28-position dual-row layout with 0.050 inch (1.27 mm) pitch for ultra-high-density interconnects
- High-reliability socket strip design rated for repeated mating cycles in demanding environments
- Surface mount termination enables reflow soldering and automated PCB assembly compatibility
- Tape-and-reel (TR) packaging supports high-volume pick-and-place manufacturing workflows
Applications
The SFM-114-L2-ZZ-D-A-K-TR is designed for high-density board-to-board socket connections in applications such as FPGA mezzanine cards, high-speed data acquisition modules, and compact embedded computing boards. Its 0.050 inch pitch and 28-position dual-row configuration allow dense signal routing in space-constrained PCB designs while maintaining high reliability for repeated plug-and-unplug operations. The surface mount form factor simplifies integration into automated SMD assembly lines for industrial and telecom equipment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count does the SFM-114-L2-ZZ-D-A-K-TR offer for high-density board interconnects?
The SFM-114-L2-ZZ-D-A-K-TR offers 28 positions in a dual-row layout with 0.050 inch (1.27 mm) pitch. This fine pitch allows twice the connection density compared to standard 0.100 inch pitch connectors in the same footprint, making it ideal for high-speed signal interfaces on compact PCBs such as FPGA expansion cards and data acquisition modules with 14 pins per row.
How does the high-reliability rating of SFM-114-L2-ZZ-D-A-K-TR benefit field-serviceable equipment?
The high-reliability socket strip designation ensures the SFM-114-L2-ZZ-D-A-K-TR maintains stable contact resistance over many mating and unmating cycles, typically rated for hundreds of insertions. This is critical in field-serviceable systems such as modular test equipment, plug-in compute modules, and daughtercard assemblies where boards are removed and reinstalled multiple times during maintenance or configuration changes.
Can the SFM-114-L2-ZZ-D-A-K-TR be assembled using standard SMD reflow soldering equipment?
Yes, the SFM-114-L2-ZZ-D-A-K-TR is a surface mount connector fully compatible with standard SMD reflow soldering processes. It ships in tape-and-reel (TR) packaging to support automated pick-and-place assembly. The 0.050 inch pitch requires fine-pitch SMD handling capabilities, but is compatible with modern solder paste printing and reflow oven equipment used in professional PCB manufacturing.
What board-to-board applications are best matched to the SFM-114-L2-ZZ-D-A-K-TR socket strip?
The SFM-114-L2-ZZ-D-A-K-TR is best matched to applications requiring compact 28-pin dual-row sockets for mezzanine cards, FPGA evaluation boards, rugged industrial I/O modules, and portable test instruments. The 0.050 inch pitch enables signal routing at densities suitable for parallel data buses, differential signal pairs, and mixed power-plus-signal connections in systems with constrained board area.
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