SFM-114-L2-H-D-LC-TR SAMTEC Connector (Other) In Stock
Samtec SFM-114-L2-H-D-LC-TR is a 28-position dual-row high-reliability surface mount socket strip with 0.050" (1.27 mm) pitch and tape-and-reel packaging, optimized for automated assembly in board-to-board mezzanine connector applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 28
- Lifecycle
- ACTIVE
- Datasheet
- SFM-114-L2-H-D-LC-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-114-L2-H-D-LC-TR?
- 28-position dual-row, 0.050" (1.27 mm) pitch for high-density board-to-board mezzanine signal routing
- Tape-and-reel (-TR) packaging enables high-speed automated pick-and-place PCB assembly
- High-reliability gold-plated contacts ensure low contact resistance and extended mating cycle durability
- Surface mount termination with low-crosstalk (LC) option for improved signal integrity at high data rates
What is SFM-114-L2-H-D-LC-TR used for?
The SFM-114-L2-H-D-LC-TR is designed for high-density board-to-board mezzanine interconnect in FPGA module assemblies, embedded computing platforms, and high-speed communications equipment. The tape-and-reel packaging makes it particularly suitable for high-volume automated SMT production lines where consistent placement accuracy across 28 dual-row positions is required. Its low-crosstalk construction supports signal integrity in backplane and daughtercard designs operating at multi-gigabit data rates.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-114-L2-H-D-LC-TR datasheet?
SFM-114-L2-H-D-LC-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-114-L2-H-D-LC-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the -LC suffix mean in the SFM-114-L2-H-D-LC-TR, and how does it affect signal performance?
The -LC suffix in SFM-114-L2-H-D-LC-TR designates a low-crosstalk contact design. This option reduces near-end and far-end crosstalk between adjacent signal pairs in the 28-position dual-row connector, making it suitable for high-speed board-to-board links operating at data rates above 1 Gbps. Lower crosstalk improves bit error rate margins in FPGA and communications board mezzanine assemblies.
Why is the -TR (tape-and-reel) packaging of the SFM-114-L2-H-D-LC-TR beneficial for manufacturing?
Tape-and-reel packaging allows the SFM-114-L2-H-D-LC-TR to be fed directly into automated SMT pick-and-place machines, improving throughput and placement accuracy across the 28 dual-row surface mount contacts. This packaging format reduces handling damage risk and is required for high-volume production runs where manual loading of individual connectors would be impractical and slow.
How does the SFM-114-L2-H-D-LC-TR differ from the SFM-114-L2-H-D-A-P variant?
The SFM-114-L2-H-D-LC-TR includes the low-crosstalk (-LC) contact design and tape-and-reel (-TR) packaging, while the SFM-114-L2-H-D-A-P uses a standard contact style and tray packaging. Both share the same 28-position dual-row, 0.050" pitch surface mount configuration, but the LC variant is preferred for high-speed signal applications and high-volume automated assembly lines requiring tape-and-reel feed.
For a compact FPGA daughtercard with 28 high-speed signal lines, how does the SFM-114-L2-H-D-LC-TR help?
The SFM-114-L2-H-D-LC-TR provides exactly 28 dual-row positions at 0.050" (1.27 mm) pitch, matching the pin count requirement while fitting within the tight board area of a compact FPGA daughtercard. Its low-crosstalk design maintains signal integrity for high-speed differential pairs at data rates exceeding 1 Gbps, and its surface mount termination ensures reliable mechanical attachment during reflow soldering at standard SMT peak temperatures.
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