SFM-114-L2-H-D-A-P SAMTEC Connector (Other) In Stock
Samtec SFM-114-L2-H-D-A-P is a 28-position dual-row high-reliability surface mount socket strip with 0.050" (1.27 mm) pitch, engineered for secure board-to-board and mezzanine interconnect applications in compact electronics designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 28
- Lifecycle
- ACTIVE
- Datasheet
- SFM-114-L2-H-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 28-position dual-row layout at 0.050" (1.27 mm) pitch for high-density mezzanine board connections
- High-reliability gold-plated contacts rated for repeated mating cycles in demanding environments
- Surface mount termination compatible with reflow soldering for automated PCB production
- Mates with Samtec SFM/SFH series headers for versatile stack-height mezzanine configurations
Applications
The SFM-114-L2-H-D-A-P is used in board-to-board mezzanine assemblies for FPGA evaluation boards, test and measurement instruments, and embedded computing modules requiring 28 dual-row connections at 0.050" pitch. Its high-reliability construction is well suited for industrial control systems, communications equipment, and defense electronics where signal integrity and mechanical durability are critical. The surface mount footprint enables automated assembly in high-volume PCB manufacturing environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the SFM-114-L2-H-D-A-P have, and in what row configuration?
The SFM-114-L2-H-D-A-P provides 28 positions in a dual-row arrangement with a 0.050" (1.27 mm) pitch, meaning 14 contacts per row. This compact layout enables high-density signal routing in board-to-board mezzanine designs while keeping the connector footprint small, making it suitable for space-constrained PCBs in embedded computing and communications applications.
What mating connectors are compatible with the SFM-114-L2-H-D-A-P for mezzanine stacking?
The SFM-114-L2-H-D-A-P mates with Samtec's SFM and SFH series headers. These mating connectors are available in multiple stack heights, typically from 5 mm to over 15 mm, allowing engineers to select the appropriate board separation for their mezzanine assembly. The 28-pin dual-row mating interface ensures all signal connections are maintained with low contact resistance across the rated mating cycles.
Why is the surface mount termination of the SFM-114-L2-H-D-A-P preferred for high-volume PCB production?
Surface mount termination on the SFM-114-L2-H-D-A-P allows reflow soldering and automated pick-and-place assembly, which reduces manufacturing time and improves placement accuracy compared to through-hole connectors. The 28-position dual-row SMT footprint maintains excellent coplanarity for reliable solder joints, supporting high-volume production of compact boards in industrial and communications hardware.
In which reliability-critical applications can the SFM-114-L2-H-D-A-P be deployed?
The SFM-114-L2-H-D-A-P's high-reliability gold-plated contacts and robust mechanical design make it suitable for defense electronics, industrial automation, and aerospace instrumentation where connectors must endure hundreds of mating cycles without degradation. Its 28-position, 0.050" pitch configuration also fits FPGA daughter card and test fixture applications where stable electrical connections over a -55°C to +125°C temperature range are required.
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