SFM-113-T2-STL-D-LC-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-113-T2-STL-D-LC-TR is a 26-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch, surface mount T2 terminal style, and tape-and-reel packaging for automated assembly. Designed for fine-pitch high-density board-to-board interconnect with long-machined contacts.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 26
- Lifecycle
- ACTIVE
- Datasheet
- SFM-113-T2-STL-D-LC-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-113-T2-STL-D-LC-TR?
- 26-position dual-row 0.050" (1.27 mm) pitch SMT socket strip for high-density fine-pitch board interconnect applications
- T2 terminal style provides right-angle SMT termination, enabling low-profile horizontal board-to-board or board-to-cable mating
- Long-machined (LC) contacts deliver enhanced contact wipe and durability for applications requiring repeated mating over 100 cycles
- Tape-and-reel (TR) packaging compatible with automated pick-and-place SMT assembly for efficient high-volume production
What is SFM-113-T2-STL-D-LC-TR used for?
The SFM-113-T2-STL-D-LC-TR is intended for fine-pitch mezzanine and daughter card connections in compact embedded systems, portable instrumentation, and aerospace electronics where space is at a premium. The 0.050" pitch and 26-position dual-row configuration allow 26 signal lines to traverse a very small PCB area, reducing board real estate by up to 75% compared to 0.100" pitch alternatives. The long-machined contacts make this connector appropriate for modular designs where daughter cards are regularly swapped during maintenance or field reconfiguration.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-113-T2-STL-D-LC-TR datasheet?
SFM-113-T2-STL-D-LC-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-113-T2-STL-D-LC-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count does the SFM-113-T2-STL-D-LC-TR offer for fine-pitch board connections?
The SFM-113-T2-STL-D-LC-TR provides 26 positions in a dual-row arrangement at a 0.050" (1.27 mm) pitch, giving 13 contacts per row. The 1.27 mm pitch reduces the connector footprint by approximately 50% compared to 2.54 mm pitch alternatives, making it well suited for compact PCBs in portable instruments and high-density embedded modules where every square millimeter matters.
How does the LC long-machined contact in SFM-113-T2-STL-D-LC-TR improve mating reliability?
The LC long-machined contact designation indicates an extended contact wipe length that improves self-cleaning action during insertion. This longer wipe removes surface contaminants and ensures a reliable low-resistance electrical path rated below 30 mΩ per contact. The enhanced wipe geometry is particularly valuable in environments where contacts may develop thin oxide layers between infrequent mating events, such as maintenance intervals longer than 6 months.
What does the T2 terminal style mean for PCB layout of the SFM-113-T2-STL-D-LC-TR?
The T2 terminal style specifies a right-angle SMT lead configuration, so the connector body sits flat on the PCB while the mating direction is parallel to the board surface. This reduces the vertical stack height to under 5 mm compared to vertical mating socket styles, allowing daughter cards to be mounted horizontally in systems with tight height constraints, such as 1U rack-mount or slim embedded enclosures.
When is SFM-113-T2-STL-D-LC-TR a suitable alternative to a 0.100" pitch connector in a redesign?
The SFM-113-T2-STL-D-LC-TR becomes the preferred alternative when a PCB redesign must reduce connector footprint while maintaining 26 signal connections. Switching from a 0.100" (2.54 mm) pitch connector to this 0.050" (1.27 mm) pitch version can reclaim approximately 20 mm of PCB length for a 26-position row, which is significant in wearable devices, camera modules, or compact UAV flight controllers where board dimensions are fixed by industrial design constraints.
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