SFM-113-T2-LM-D-LC-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-113-T2-LM-D-LC-TR is a 26-position dual-row high reliability surface mount socket strip with 0.050" (1.27 mm) pitch, designed for high-density board-to-board and mezzanine applications. Features low-insertion-force contacts with gold-plated terminations ensuring reliable signal integrity across thousands of mating cycles. Available from stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 26
- Lifecycle
- ACTIVE
- Datasheet
- SFM-113-T2-LM-D-LC-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 26-position dual-row layout at 0.050" (1.27 mm) pitch for high-density interconnects
- High reliability socket strip design rated for thousands of mating cycles
- Surface mount termination compatible with standard SMT reflow assembly processes
- Low current capability contacts suitable for signal and low-power applications
Applications
The SFM-113-T2-LM-D-LC-TR is well suited for high-density mezzanine and board-to-board stacking configurations in telecom, industrial control, and embedded computing hardware. Its 26-position dual-row arrangement supports compact module designs where space is limited yet reliable signal connections across 1.27 mm pitch are required. It is also commonly used in test and measurement equipment and FPGA daughter card interconnect assemblies.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and row configuration does the SFM-113-T2-LM-D-LC-TR use?
The SFM-113-T2-LM-D-LC-TR uses a 0.050 inch (1.27 mm) pitch with 26 positions arranged in a dual-row configuration, giving 13 positions per row. This tight pitch enables high-density interconnects suitable for compact embedded systems and mezzanine board designs.
For a board-stacking design, how does SFM-113-T2-LM-D-LC-TR compare to SFM-112-T2-L-D-A-P in terms of pin count?
The SFM-113-T2-LM-D-LC-TR offers 26 pins (dual-row, 13 per row) while the SFM-112-T2-L-D-A-P provides 24 pins. Both share the same 0.050 inch pitch and dual-row SMT footprint, so choosing between them depends on whether your design requires 24 or 26 signal connections in the connector zone.
Which assembly process is compatible with the SFM-113-T2-LM-D-LC-TR, and what soldering method should be used?
The SFM-113-T2-LM-D-LC-TR is a surface mount component compatible with standard SMT reflow soldering at typical lead-free reflow peak temperatures of around 260°C. Its SMD footprint integrates into automated pick-and-place assembly lines, and the tape-and-reel (TR) packaging supports high-volume production with continuous feeding.
Can SFM-113-T2-LM-D-LC-TR be used in space-constrained FPGA module interconnects requiring high signal count?
Yes, the SFM-113-T2-LM-D-LC-TR is well suited for FPGA daughter-card and module interconnects where board real estate is limited. With 26 positions at 1.27 mm pitch arranged in 2 rows, it delivers a high signal count in a compact SMT footprint, enabling reliable digital signal routing between main boards and FPGA mezzanine cards.
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