SFM-113-T2-LM-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-113-T2-LM-D-A-P is a 26-position dual-row high-reliability surface-mount socket strip with 0.050-inch pitch and low-mounting-profile contacts. Precision-formed contacts provide consistent impedance and low crosstalk for high-speed PCB signal routing. Suited for dense mezzanine board configurations in embedded computing, telecom, and test equipment designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 26
- Lifecycle
- ACTIVE
- Datasheet
- SFM-113-T2-LM-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 26-position dual-row (2x13) layout at 0.050" (1.27 mm) pitch offering high contact density in a compact SMT footprint
- Low-mounting (LM) contact profile reducing the overall stack height for space-constrained mezzanine board assemblies
- High-reliability socket strip design with controlled impedance contacts supporting multi-GHz signal integrity
- Surface-mount termination compatible with lead-free reflow soldering up to 260°C for modern PCB assembly processes
Applications
The SFM-113-T2-LM-D-A-P is designed for low-profile mezzanine board stacking in compact embedded computing platforms, FPGA daughter cards, and portable test instrumentation. Its 26-position dual-row configuration at 0.050-inch pitch provides 26 signal connections with a reduced stack height, enabling tighter board-to-board spacing in height-constrained enclosures. The high-reliability contacts maintain signal integrity at multi-GHz data rates in telecommunications and industrial electronics equipment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the low-mounting (LM) designation affect the stack height of SFM-113-T2-LM-D-A-P mezzanine assemblies?
The low-mounting (LM) designation means the SFM-113-T2-LM-D-A-P contacts extend to a reduced height above the PCB surface compared to standard-height variants. This decreases the mated board-to-board stack height, enabling designers to fit two stacked PCBs into enclosures with less than 5 mm of vertical clearance, which is critical in slim portable instruments and tight rack modules with 26-pin interconnect requirements.
How many signals can SFM-113-T2-LM-D-A-P route simultaneously and in what arrangement?
The SFM-113-T2-LM-D-A-P provides 26 positions in a dual-row (2x13) arrangement at 0.050-inch (1.27 mm) pitch. All 26 contacts can carry independent signals or can be allocated as 12 differential pairs plus 2 ground returns, supporting high-speed serial protocols such as LVDS or PCIe in FPGA mezzanine and embedded computing board designs.
Is SFM-113-T2-LM-D-A-P a drop-in replacement for similar 26-position SAMTEC SFM series connectors?
SFM-113-T2-LM-D-A-P shares the standard SFM series 0.050-inch (1.27 mm) dual-row footprint, making it electrically and mechanically compatible with other 26-position SFM variants that use the same T2 contact style. However, the LM (low-mount) height differs from standard-height variants, so verify the mated stack height specification — typically measured in tenths of a millimeter — matches your board spacing before substitution to ensure proper PCB clearance.
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