SFM-113-T2-H-D-LC-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-113-T2-H-D-LC-TR is a 26-position dual-row surface mount socket strip with 0.050" (1.27mm) pitch and high-profile (H) housing. Gold-plated low-current contacts with tape-and-reel packaging support automated PCB assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 26
- Lifecycle
- ACTIVE
- Datasheet
- SFM-113-T2-H-D-LC-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-113-T2-H-D-LC-TR?
- 26-position dual-row layout on 0.050" (1.27 mm) pitch, maximizing contact density in space-constrained designs
- High-profile (H) housing variant provides additional mating clearance for board stacking or component height requirements
- Low-current (LC) gold-plated contacts minimize contact resistance for reliable signal integrity at logic-level voltages
What is SFM-113-T2-H-D-LC-TR used for?
The SFM-113-T2-H-D-LC-TR is designed for high-density board-to-board and mezzanine interconnects in embedded computing, communications, and test equipment. Its 26-position dual-row configuration suits applications requiring moderate pin counts with compact footprint. The surface mount format and tape-and-reel packaging support automated high-volume assembly.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-113-T2-H-D-LC-TR datasheet?
SFM-113-T2-H-D-LC-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-113-T2-H-D-LC-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the SFM-113-T2-H-D-LC-TR have and what is its pin pitch?
The SFM-113-T2-H-D-LC-TR has 26 total positions arranged in a dual-row configuration with 13 pins per row, on a 0.050-inch (1.27 mm) pitch. This fine pitch enables high-density interconnects while keeping PCB footprint compact.
What role does the 'H' designation play in the SFM-113-T2-H-D-LC-TR's design?
The 'H' designation indicates a high-profile housing, which provides additional vertical clearance of approximately 2.54 mm above the PCB compared to standard-profile variants. This is useful in board stacking applications where component height must accommodate neighboring parts or mating connectors.
Which design scenarios benefit most from the SFM-113-T2-H-D-LC-TR's low-current rating?
Applications involving signal and data lines at voltages up to 5 V and currents below 1 A per contact benefit from the LC rating. Examples include microcontroller expansion interfaces, FPGA daughter card connectors, and communication bus lines where contact resistance under 20 milliohms is important for signal fidelity.
How does the SFM-113-T2-H-D-LC-TR compare to a 22-position SFM variant for mixed-signal boards?
The 26-position SFM-113-T2-H-D-LC-TR provides 4 additional contacts compared to the 22-position SFM-111 variant, allowing designers to route more signal lines—such as 4 extra SPI or GPIO channels—through a single connector without increasing board area beyond the 1.27 mm pitch baseline.
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