SFM-113-L2-STL-D-LC-TR SAMTEC Connector (Other) In Stock
SFM-113-L2-STL-D-LC-TR is a 26-position dual-row high-reliability surface-mount socket strip from Samtec with 1.27 mm (0.050 inch) pitch, low-clearance STL contacts, and tape-and-reel packaging for automated SMT assembly. It enables compact, reworkable board-to-board interconnect in miniature electronics. From stock, worldwide shipping available.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 26
- Lifecycle
- ACTIVE
- Datasheet
- SFM-113-L2-STL-D-LC-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-113-L2-STL-D-LC-TR?
- 26-position dual-row layout at 1.27 mm (0.050 inch) pitch for high-density compact SMT board-to-board interconnect
- STL contact style supporting reworkable attachment while maintaining reliable electrical contact across 26 positions
- LC low-clearance geometry minimizing vertical stack height for tight board-to-board assembly configurations
- Tape-and-reel (TR) packaging enabling automated pick-and-place SMT assembly in high-volume production
- High-reliability gold-plated contacts providing consistent low contact resistance over thousands of mating cycles
What is SFM-113-L2-STL-D-LC-TR used for?
The SFM-113-L2-STL-D-LC-TR is designed for compact board-to-board mezzanine interconnect in miniature embedded computing modules, wearable electronic devices, and aerospace avionics sub-assemblies where 26 signals must be interconnected at 1.27 mm pitch with a minimal connector height profile. Its STL contact style combined with LC low-clearance geometry makes it well-suited for stacked PCB designs requiring reworkable connector placement in tight vertical envelopes. The tape-and-reel packaging supports efficient high-volume automated SMT assembly.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-113-L2-STL-D-LC-TR datasheet?
SFM-113-L2-STL-D-LC-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-113-L2-STL-D-LC-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the combination of STL contacts and LC low-clearance geometry in the SFM-113-L2-STL-D-LC-TR benefit a board-stack design?
The STL contact style in the SFM-113-L2-STL-D-LC-TR provides reworkable attachment so the connector can be repositioned or replaced without full PCB reflow, while the LC low-clearance geometry keeps the mated stack height as small as possible. Together, these features allow a 26-position 1.27 mm pitch interconnect in designs where both minimal z-height, such as 2 mm or less between PCBs, and repairability during engineering validation are required.
What is the contact count and pitch of the SFM-113-L2-STL-D-LC-TR, and how does the dual-row layout reduce PCB footprint?
The SFM-113-L2-STL-D-LC-TR provides 26 contact positions in a dual-row format with 13 contacts per row at 1.27 mm (0.050 inch) pitch. The dual-row design reduces the required PCB edge length by 50 percent compared to a single-row 26-pin alternative at the same pitch, enabling compact board-to-board interconnect on miniature sensor modules, FPGA daughter cards, and embedded system-on-module designs with constrained PCB dimensions.
Is the SFM-113-L2-STL-D-LC-TR suitable for high-volume automated PCB assembly, and how is it packaged?
Yes, the SFM-113-L2-STL-D-LC-TR is supplied in tape-and-reel (TR) format, making it directly compatible with automated pick-and-place assembly machines for high-volume SMT production. The 1.27 mm pitch surface-mount termination allows precise robotic placement across all 26 positions with standard reflow soldering, enabling consistent quality in high-volume manufacturing of wearable electronics, industrial sensor boards, and compact embedded computing modules.
When should a designer choose the SFM-113-L2-STL-D-LC-TR over a 26-position connector at 2.54 mm pitch for a mezzanine interface?
The SFM-113-L2-STL-D-LC-TR at 1.27 mm pitch is the right choice when the PCB footprint for the 26-position connector must be as small as possible, occupying roughly half the board space of an equivalent 2.54 mm pitch alternative. Fine-pitch 1.27 mm connectors are also preferred in stacked module designs where minimizing the board-to-board gap via the LC low-clearance contacts is critical, such as in wearable devices, avionics modules, or compact IoT hardware with strict dimensional constraints.
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