SFM-113-L2-H-D-LC-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-113-L2-H-D-LC-TR is a 26-position dual-row high-reliability surface mount socket strip with 0.050" (1.27 mm) pitch, long-tail SMT terminations, and low-clearance (LC) mated height. Supplied in tape-and-reel format for automated SMT pick-and-place assembly. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 26
- Lifecycle
- ACTIVE
- Datasheet
- SFM-113-L2-H-D-LC-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 26-position dual-row 0.050" (1.27 mm) pitch SMT socket strip in a compact low-clearance (LC) mated profile for slim board-to-board stacks
- Long-tail (L2) SMT terminations increase solder fillet area for superior mechanical robustness against vibration and shock
- High-reliability (H) grade with gold-plated contacts rated for 500+ mating cycles for aerospace, defense, and medical applications
- Tape-and-reel (TR) packaging enables automated SMT pick-and-place assembly in high-volume production lines
Applications
The SFM-113-L2-H-D-LC-TR is used in compact board-to-module and mezzanine card assemblies in medical devices, military electronics, and portable instrumentation where a 26-position 0.050" pitch low-clearance SMT socket minimizes board stack height. Its high-reliability H-grade contacts support frequent mating cycles in field-serviceable handheld test equipment, wearable monitoring devices, and ruggedized IoT gateways. The tape-and-reel packaging facilitates efficient automated assembly in volume production of small form-factor embedded computers and sensor interface boards.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What board-to-board stack height does the low-clearance (LC) profile of SFM-113-L2-H-D-LC-TR enable?
The low-clearance (LC) designation on the SFM-113-L2-H-D-LC-TR specifies a minimized mated board-to-board separation, typically achieving stack heights of 3 mm or less when paired with the matching SFM-series header, compared to 5-8 mm for standard-clearance variants. This slim profile is critical in wearable devices, compact medical monitors, and portable instruments where every millimeter of total device thickness must be conserved across a 26-position dual-row 0.050" pitch interface.
How does the 26-position SFM-113-L2-H-D-LC-TR compare to larger SFM variants for module interface selection?
The 26-position SFM-113-L2-H-D-LC-TR is the lower pin-count end of the SFM series at 0.050" pitch, providing 13 positions per row — suitable for interfaces carrying up to 26 single-ended signals or 13 differential pairs. Larger SFM variants such as the SFM-139 (78 positions) or SFM-128 (56 positions) serve higher-bandwidth interfaces, while the 26-position count fits microcontroller expansion headers, sensor module connectors, and small FPGA GPIO banks.
What mating cycle rating does the H-grade contact system of SFM-113-L2-H-D-LC-TR provide?
The high-reliability (H) grade contact system in the SFM-113-L2-H-D-LC-TR is rated for 500 or more mating cycles while maintaining contact resistance below specified limits (typically under 30 mΩ) across the full operating temperature range of -55°C to +125°C. This rating supports field-maintenance scenarios in medical diagnostics equipment and military radios where connector modules are regularly swapped or upgraded by technicians.
Can the SFM-113-L2-H-D-LC-TR be assembled using standard automated SMT reflow processes?
Yes, the SFM-113-L2-H-D-LC-TR is supplied in tape-and-reel (TR) format and features long-tail (L2) SMT terminations designed for automated pick-and-place placement followed by lead-free reflow soldering at peak temperatures up to 260°C per J-STD-020. The long-tail geometry increases the solder fillet contact area compared to standard tails, improving mechanical joint reliability across all 26 positions in a single reflow pass without the need for secondary soldering operations.
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