SFM-113-02-L-D-A-P SAMTEC Connector (Other) In Stock

SAMTEC SFM-113-02-L-D-A-P is a 26-position dual-row surface-mount socket strip with 0.050 inch pitch, featuring beryllium copper contacts with 10 µin gold over 50 µin nickel mating finish and polarization key. Designed for high-reliability board-to-board signal connections.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
SFM-113-02-L-D-A-POther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
26
Lifecycle
ACTIVE
Category
Connector
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 26-position dual-row SMT socket with 0.050 inch (1.27 mm) pitch and polarization key for foolproof mating
  • Beryllium copper contacts with 10 µin gold over 50 µin nickel deliver low contact resistance and high spring-force retention
  • Female socket strip design for repeated mate/unmate cycles in test, debug, and modular board applications

Applications

The SFM-113-02-L-D-A-P is used in high-reliability embedded systems, daughter-card interfaces, and modular computing platforms where a compact 0.050 inch pitch dual-row socket is required. Its beryllium copper contacts with gold mating surface provide stable electrical performance across thousands of insertion cycles, making it ideal for field-replaceable modules and test fixture applications. Polarization prevents reverse insertion, which is critical in aerospace electronics, medical devices, and industrial control boards.

Specifications

YTEOL9.4
Additional FeaturePOLARIZED
Body/Shell StyleSOCKET
Connector TypeBOARD CONNECTOR
Contact Finish MatingGOLD (10) OVER NICKEL (50)
Contact Finish TerminationMatte Tin (Sn) - with Nickel (Ni) barrier
Contact GenderFEMALE
Contact MaterialBERYLLIUM COPPER
DIN ConformanceNO
Filter FeatureNO
IEC ConformanceNO
JESD-609 Codee3
MIL ConformanceNO
Mixed ContactsNO
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number of Rows Loaded2
OptionGENERAL PURPOSE
Rated Current (Signal)3.2A
Terminal Pitch1.27mm
Termination TypeSURFACE MOUNT
Total Number of Contacts26
UL Flammability Code94V-0
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40
Country of OriginUSA

Datasheet

SFM-113-02-L-D-A-P Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What contact material and finish does the SFM-113-02-L-D-A-P use for reliable mating performance?

The SFM-113-02-L-D-A-P uses beryllium copper contacts with 10 µin gold plated over 50 µin nickel on the mating surface, providing contact resistance below 20 milliohms. The termination side uses matte tin over nickel barrier for compatibility with standard solder reflow at up to 260°C.

How does the polarization feature of the SFM-113-02-L-D-A-P protect against assembly errors?

The polarization key on the SFM-113-02-L-D-A-P physically prevents reverse or misaligned insertion of the mating plug connector. This is critical for dual-row 26-position connectors where incorrect mating could apply voltage to wrong pins, potentially damaging circuits operating at 3.3 V or 5 V logic levels.

For which industries is the SFM-113-02-L-D-A-P a suitable choice, and what test conditions must it survive?

The SFM-113-02-L-D-A-P is rated for high-reliability applications including aerospace, defense, and industrial automation. It is engineered to survive thermal cycling from -55°C to +125°C and withstand contact engaging forces typical of beryllium copper springs, maintaining consistent performance across 500 or more mating cycles.

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About SAMTEC

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AvailabilityIn Stock
Reference Price (USD)
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pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

MR
Marco Rossi
CTO, AutoDrive Systems, Italy