SFM-113-02-H-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-113-02-H-D-A-P is a 26-position dual-row high-reliability SMT socket strip with 1.27 mm (0.050 inch) pitch. It provides 13 positions per row with an anti-backout (A) and polarization (P) option in a surface-mount high-profile (H) package, ensuring secure mating and correct orientation in critical board-to-board interconnect designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 26
- Lifecycle
- ACTIVE
- Datasheet
- SFM-113-02-H-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-113-02-H-D-A-P?
- 26 positions in dual-row 1.27 mm pitch configuration spanning approximately 16.51 mm row length delivers fine-pitch signal density in a compact SMT footprint
- Anti-backout (A) retention feature mechanically locks the mated connector pair, preventing unintended unmating under vibration loads typical in automotive and industrial environments
- Polarization (P) option with high-profile (H) body prevents reverse connector insertion and provides added clearance for mating alignment in field-replaceable module designs
What is SFM-113-02-H-D-A-P used for?
The SFM-113-02-H-D-A-P is suited for vibration-resistant board-to-board and mezzanine connections in automotive electronics, industrial control modules, and rugged embedded computing boards where secure 26-signal fine-pitch interfaces are required. Its anti-backout retention and polarization features make it particularly valuable in field-replaceable modules that are repeatedly mated and unmated by service technicians. The 1.27 mm pitch dual-row layout efficiently routes 26 mixed signals including power, ground, and data lines in a minimal PCB footprint.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-113-02-H-D-A-P datasheet?
SFM-113-02-H-D-A-P Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-113-02-H-D-A-P?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the anti-backout (A) option on SFM-113-02-H-D-A-P provide in vibration-prone environments?
The anti-backout (A) option incorporates a mechanical latch that prevents the mated connector pair from separating under axial vibration forces. In automotive applications subject to random vibration profiles up to 20 g per IEC 60068-2-64, the anti-backout feature maintains contact resistance below 20 mΩ and prevents intermittent disconnections. This is critical for 26-signal interfaces routing CAN bus, SPI, or power lines where a momentary open circuit could trigger system faults or ECU resets.
How does the high-profile (H) variant of SFM-113 differ from the standard and low-clearance versions?
The high-profile (H) variant provides a greater mated stack height, typically 6 mm to 11 mm, compared to the low-clearance (LC) variant's stack height below 4 mm. This additional height allows routing of 0.5 mm diameter wires or flat flexible cables between the two mated PCBs, and improves mating alignment tolerance to ±0.5 mm lateral offset, making field assembly easier in environments where board-to-board gap cannot be tightly controlled to within 0.1 mm.
Which signal interface types are efficiently supported by the 26-position 1.27 mm dual-row SFM-113?
The 26 positions of the SFM-113-02-H-D-A-P can simultaneously carry one 16-bit parallel data bus plus 8 control lines, or two full USB 3.0 SuperSpeed differential pairs (4 signals each) with power and ground pins, or a combined interface of two SPI buses, I2C, UART, and 4 GPIO lines within a single 16.51 mm row connector. The 1.27 mm fine pitch supports differential signal pairs with a 1.27 mm center-to-center spacing, maintaining impedance control at signal frequencies up to 1 GHz.
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