SFM-112-T2-F-D-LC-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-112-T2-F-D-LC-TR is a 24-position dual-row high-reliability surface-mount socket strip with 1.27 mm (0.050") pitch, flat lead (F) contact style, and latching cover (LC) for positive mating retention. Tape-and-reel packaged for automated assembly. From $2.80 in stock worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 24
- Lifecycle
- ACTIVE
- Datasheet
- SFM-112-T2-F-D-LC-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-112-T2-F-D-LC-TR?
- 24-position dual-row configuration at 1.27 mm (0.050") pitch supporting dense signal routing in board-to-board mezzanine assemblies
- Flat lead (F) contact style providing low-profile solder tails optimized for surface-mount reflow soldering
- Latching cover (LC) option ensuring positive mating retention and preventing accidental disconnection in vibration-prone environments
- Tape-and-reel (TR) packaging supporting high-volume automated SMT pick-and-place production at standard reel quantities
What is SFM-112-T2-F-D-LC-TR used for?
The SFM-112-T2-F-D-LC-TR is designed for board-to-board and mezzanine stack applications in telecommunications, embedded computing, and aerospace systems where 24 dual-row connections at 1.27 mm pitch with secure latching are required. The latching cover option provides positive mating retention essential in applications subject to mechanical shock or vibration, such as avionics rack assemblies and mobile industrial equipment. Tape-and-reel packaging facilitates high-volume automated production in commercial and military electronics manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-112-T2-F-D-LC-TR datasheet?
SFM-112-T2-F-D-LC-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-112-T2-F-D-LC-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the SFM-112-T2-F-D-LC-TR provide, and what is its contact pitch?
The SFM-112-T2-F-D-LC-TR provides 24 positions in a dual-row layout with a 1.27 mm (0.050 inch) pitch, giving 12 contacts per row. This 1.27 mm pitch is a standard high-density format compatible with SAMTEC TSM and TFM series mating headers, enabling reliable board-to-board signal interconnects in compact mezzanine stack designs.
What advantage does the latching cover (LC) option on the SFM-112-T2-F-D-LC-TR provide in shock and vibration applications?
The latching cover (LC) mechanically locks the mated connector pair, requiring a deliberate release action to disengage. This positive retention prevents the 24-pin dual-row socket from vibrating free in high-shock environments such as avionics racks or mobile industrial platforms rated for 10 G shock, where unlatched 1.27 mm pitch connectors are prone to accidental disconnection during transport or operation.
How does the flat lead (F) contact style of the SFM-112-T2-F-D-LC-TR differ from a standard gull-wing lead in SMT assembly?
The flat lead (F) style on the SFM-112-T2-F-D-LC-TR presents a planar solder tail flush with the PCB pad, compared to the curved gull-wing which extends outward. Flat leads reduce the connector's footprint extension beyond the body by roughly 0.2 mm to 0.4 mm per side, enabling tighter component spacing in dense 1.27 mm pitch SMT board regions where gull-wing protrusion would violate component clearance rules.
For a 24-pin mezzanine board interface, when is the SFM-112-T2-F-D-LC-TR preferred over a cable-based solution?
The SFM-112-T2-F-D-LC-TR is preferred when the two PCBs need to remain parallel and coplanar, as in a mezzanine stack where the total mated height must be kept under 10 mm. A 24-pin dual-row cable assembly at 1.27 mm pitch would add at least 5 mm to 10 mm of cable loop height and introduce impedance discontinuities at speeds above 1 Gbps, making the board-to-board socket strip the better choice for high-speed or space-critical designs.
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