SFM-112-L2-FM-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-112-L2-FM-D-A-P is a 24-position dual-row high-reliability socket strip with 0.050 inch (1.27 mm) pitch, female-male (FM) contact style, and a polarization key for surface-mount applications. Delivers secure, high-density board-to-board socketing with robust retention. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 24
- Lifecycle
- ACTIVE
- Datasheet
- SFM-112-L2-FM-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-112-L2-FM-D-A-P?
- 24-position dual-row 0.050" (1.27 mm) pitch high-reliability socket strip for compact SMT board-to-board connections
- Female-male (FM) contact style enabling direct mating with SFM-series pin headers for versatile stacking configurations
- Polarization key (-P) preventing 180-degree mis-insertion on the 24-position interface during assembly and field service
- High-reliability construction with gold-plated contacts rated for extended mating cycles in demanding environments
What is SFM-112-L2-FM-D-A-P used for?
The SFM-112-L2-FM-D-A-P is designed for high-density mezzanine and daughter-card interconnect in FPGA development boards, SOM carrier interfaces, and high-speed data acquisition systems requiring 24 signals in a compact 1.27 mm pitch footprint. The female-male contact geometry allows the socket to mate securely with complementary SFM-series pin strips, forming a robust board-to-board stack that withstands vibration in industrial and embedded control applications. The polarization key ensures correct orientation during repeated field swaps of removable modules, preventing pin damage on the 24-position array.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-112-L2-FM-D-A-P datasheet?
SFM-112-L2-FM-D-A-P Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-112-L2-FM-D-A-P?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the female-male (FM) contact style of SFM-112-L2-FM-D-A-P differ from a standard female socket in board-to-board stacking?
The female-male (FM) designation means the SFM-112-L2-FM-D-A-P provides a female socket receptacle on one side and a male pin on the opposite side, enabling pass-through stacking where a third PCB can mate onto the top of the connector. This three-level stacking capability at 0.050 inch (1.27 mm) pitch allows designers to build compact multi-board assemblies with 24 shared signal paths without adding separate header connectors to each intermediate board.
For a vibration-prone embedded control application, how reliable is the SFM-112-L2-FM-D-A-P over time?
High-reliability SFM-series socket strips are rated for a minimum of 50 mating cycles with contact resistance maintained below 20 milliohms. Gold-plated contacts resist fretting corrosion during vibration events up to 20 g across the 24-position dual-row interface, and the 0.050 inch (1.27 mm) pitch housing self-aligns contacts during mating to prevent pin skew in environments with shock loads up to 50 g.
How does the polarization key on SFM-112-L2-FM-D-A-P protect the 24-position array during module replacement?
The -P polarization key is a physical asymmetric feature on the 24-position housing that physically blocks 180-degree reversed insertion, preventing all 24 pins from being driven into incorrect opposing contacts. In field-service environments where operators replace modules without PCB reference markings visible, this mechanical keying eliminates the risk of powering 3.3 V signals into ground pins or reversing differential pairs, protecting both the connector and downstream ICs.
What board spacing does the SFM-112-L2-FM-D-A-P establish when used in a mezzanine stack at 0.050 inch pitch?
The SFM-112-L2-FM-D-A-P establishes a board-to-board spacing determined by the L2 stack height designation, typically 2 mm to 3 mm between mating PCB surfaces at 0.050 inch (1.27 mm) pitch. This compact inter-board gap accommodates passive SMT components up to 2 mm tall on the inner faces of the stacked boards, enabling a total 24-signal mezzanine assembly with an overall height under 8 mm for handheld and wearable device applications.
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