SFM-112-02-FM-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-112-02-FM-D-A-K is a 24-position dual-row surface mount socket strip with 0.050" (1.27 mm) pitch, designed for high-reliability PCB interconnects. Gold-plated contacts support low resistance mating in compact embedded system designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 24
- Lifecycle
- ACTIVE
- Datasheet
- SFM-112-02-FM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 24-position dual-row layout at 0.050" (1.27 mm) pitch for compact board-to-board connections
- Surface mount (SMT) termination for compatibility with automated reflow solder assembly
- Gold-plated contacts deliver consistently low contact resistance across hundreds of mating cycles
- High-reliability construction suited to industrial, test, and embedded computing environments
Applications
The SFM-112-02-FM-D-A-K is designed for board-to-board and mezzanine interconnect applications in embedded computing, test instrumentation, and industrial control systems. Its 24-position dual-row 0.050" pitch configuration provides a compact footprint for space-constrained PCB layouts. The SMT termination style integrates smoothly into automated assembly workflows using standard reflow soldering.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and what pitch does the SFM-112-02-FM-D-A-K offer?
The SFM-112-02-FM-D-A-K provides 24 positions in a dual-row arrangement at a 0.050" (1.27 mm) pitch. This compact layout is ideal for board-to-board or mezzanine connections in designs where PCB space is limited and high-density signal routing is required.
Which assembly method is used for the SFM-112-02-FM-D-A-K, and how does it affect PCB design?
The SFM-112-02-FM-D-A-K uses surface mount termination, which eliminates the need for drilled through-holes and reduces PCB layer requirements. This SMT approach is compatible with standard 1.27 mm pitch footprints and automated pick-and-place plus reflow solder assembly, enabling efficient high-volume manufacturing.
For a low-profile mezzanine stack, how does the SFM-112-02-FM-D-A-K compare to a through-hole equivalent?
The SFM-112-02-FM-D-A-K offers a lower profile than through-hole equivalents because the SMT termination sits entirely on the PCB surface without protruding pins. Its 24-pin dual-row 1.27 mm pitch footprint occupies less board real estate, making it preferred for compact mezzanine stacking applications in embedded and instrumentation systems.
What contact plating is used on the SFM-112-02-FM-D-A-K, and how does it benefit reliability?
The SFM-112-02-FM-D-A-K uses gold-plated contacts, which maintain contact resistance typically below 20 milliohms over the connector's rated cycle life. Gold plating resists oxidation and corrosion, ensuring stable signal integrity in industrial and instrumentation environments where long-term reliability across hundreds of mating cycles is critical.
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