SFM-111-L2-S-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-111-L2-S-D-A-P is a 22-position dual-row high reliability surface mount socket strip with 1.27 mm (0.050 inch) pitch, offering precision stamped contacts. Designed for mezzanine and board stacking interconnect with consistent electrical performance across all 22 positions. Suitable for compact SMT footprints in industrial and high-reliability applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 22
- Lifecycle
- ACTIVE
- Datasheet
- SFM-111-L2-S-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 22-position dual-row layout with 1.27 mm (0.050") pitch for compact, high-density surface mount interconnect
- High-reliability stamped socket contacts engineered for consistent mating force and long operational life
- Surface mount termination enables low-profile board-stacking in space-constrained PCB designs
Applications
The SFM-111-L2-S-D-A-P is well suited for mezzanine card and board-stacking applications in embedded systems, where a moderate pin count of 22 positions must be routed in a 1.27 mm pitch footprint. It serves industrial controllers, test and measurement instruments, and communication daughter cards where reliable high-density signal connectivity is required. The surface mount style allows integration into standard SMT reflow assembly processes for both prototyping and production environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pitch and position count of the SFM-111-L2-S-D-A-P connector?
The SFM-111-L2-S-D-A-P provides 22 positions arranged in a dual-row format with a 1.27 mm (0.050 inch) pitch. This compact geometry allows 11 positions per row, making it suitable for routing multiple signal lines in a small PCB area for embedded industrial and computing applications.
For which mezzanine stacking board heights is the SFM-111-L2-S-D-A-P compatible?
The SFM-111-L2-S-D-A-P (L2 suffix) is designed for specific stacking heights defined by SAMTEC's SFM series, typically offering stacking heights in the range of several millimeters. Combined with its 22-position dual-row layout and 1.27 mm pitch, it allows engineers to select precise board separation distances in compact mezzanine assemblies operating at standard 3.3 V or 5 V logic levels.
How does the SFM-111-L2-S-D-A-P compare to a lower pin count alternative like SFM-105?
Compared to a 10-position SFM-105 variant, the SFM-111-L2-S-D-A-P provides 22 positions—more than double the pin count—within the same 1.27 mm pitch dual-row SFM series. This makes it better suited for interfaces requiring routing 22 independent signals or mixed signal/power lines, such as sensor interfaces or FPGA expansion connectors, without increasing the connector pitch or board area proportionally.
What assembly processes are compatible with the SFM-111-L2-S-D-A-P surface mount termination?
The SFM-111-L2-S-D-A-P is designed for surface mount technology (SMT) assembly and is compatible with standard reflow soldering processes. Its surface mount termination eliminates the need for through-hole drilling, reducing PCB fabrication cost. The compact 1.27 mm pitch footprint requires precise stencil aperture design and solder paste deposition for reliable 22-position joint formation during the reflow process.
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