SFM-111-L2-S-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-111-L2-S-D-A-K is a 22-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch in a surface mount package. Features a low-profile design with gold-plated contacts for secure, repeatable mating in dense PCB interconnect applications. Available from stock worldwide with competitive pricing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 22
- Lifecycle
- ACTIVE
- Datasheet
- SFM-111-L2-S-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 22-position dual-row 0.050" (1.27 mm) pitch surface mount socket strip enabling high-density signal routing with 11 pins per row in a compact SMT footprint
- High-reliability construction with gold-plated contacts providing low contact resistance and excellent cycle life for repeated mating and unmating in modular systems
- Low-profile surface mount design compatible with automated reflow soldering and pick-and-place assembly for efficient high-volume PCB manufacturing
Applications
The SFM-111-L2-S-D-A-K is used for mezzanine board stacking, daughter-card-to-motherboard interconnection, and modular subsystem integration in compact electronic systems. Its 0.050" pitch dual-row configuration is particularly suited for FPGAs, DSPs, and RF modules in telecommunications, defense electronics, and high-speed data acquisition platforms where board space is at a premium.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and pin configuration does the SFM-111-L2-S-D-A-K use, and how many positions does it provide?
The SFM-111-L2-S-D-A-K features a 0.050" (1.27 mm) pitch with 22 positions arranged in a dual-row layout of 11 pins per row. This high-density pitch is half the standard 0.100" spacing, enabling twice the pin count in the same board footprint, which is critical for space-constrained mezzanine and daughtercard interconnect designs in compact PCB assemblies.
For high-speed signal integrity designs, how does the SFM-111-L2-S-D-A-K's 0.050" pitch affect PCB routing?
The 0.050" (1.27 mm) pitch of the SFM-111-L2-S-D-A-K requires controlled impedance trace routing between pads spaced at 1.27 mm center-to-center, which is achievable on standard 6-layer PCBs with 4-mil trace widths and 4-mil spacing. The dual-row surface mount layout minimizes via stubs, supporting signal frequencies up to several GHz when used with matched-impedance traces and proper ground referencing on adjacent layers.
What types of mating connectors are compatible with the SFM-111-L2-S-D-A-K socket strip?
The SFM-111-L2-S-D-A-K is designed to mate with SAMTEC's corresponding TSM or SHF series header strips at 0.050" (1.27 mm) pitch with 22 positions in a dual-row arrangement. The gold-plated contact system provides reliable low-resistance mating, typically achieving contact resistance below 20 milliohms, and supports the modular daughtercard insertion and removal cycles common in test fixtures and field-replaceable module designs.
Is the SFM-111-L2-S-D-A-K suitable for automated PCB assembly, and what soldering process does it support?
Yes, the SFM-111-L2-S-D-A-K is designed for surface mount assembly with compatibility for automated pick-and-place equipment and reflow soldering at standard lead-free profiles up to 260°C peak temperature. Its surface mount footprint with 0.050" pitch pads requires precise stencil aperture design, typically 1:1 ratio with 0.5 mm pad openings, for proper solder paste deposition during high-volume manufacturing.
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