SFM-111-L2-H-D-LC-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-111-L2-H-D-LC-TR is a 22-position dual-row high reliability surface mount socket strip with 1.27 mm (0.050 inch) pitch. Designed for fine-pitch mezzanine and daughter card interconnects requiring secure socket retention. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 22
- Lifecycle
- ACTIVE
- Datasheet
- SFM-111-L2-H-D-LC-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-111-L2-H-D-LC-TR?
- 22-position dual-row fine-pitch socket at 1.27 mm (0.050 inch) spacing for compact high-density mezzanine connections
- High reliability (H) socket contact design rated for extended mating cycles in demanding applications
- Low-profile (LC) configuration minimizes stacking height for space-constrained PCB assemblies
- Tape-and-reel (TR) packaging enables automated pick-and-place SMT assembly for high-volume production
What is SFM-111-L2-H-D-LC-TR used for?
The SFM-111-L2-H-D-LC-TR is designed for fine-pitch mezzanine board interconnects in aerospace, defense, and high-reliability industrial electronics where consistent contact performance over many mating cycles is essential. Its 1.27 mm pitch and dual-row layout support high signal density in compact form factors such as small form factor compute modules and ruggedized daughter cards. The low-profile SMT design minimizes board stacking height while maintaining robust electrical continuity across all 22 positions.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-111-L2-H-D-LC-TR datasheet?
SFM-111-L2-H-D-LC-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-111-L2-H-D-LC-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count does the SFM-111-L2-H-D-LC-TR provide for fine-pitch mezzanine applications?
The SFM-111-L2-H-D-LC-TR provides 22 positions in a dual-row layout at 1.27 mm (0.050 inch) pitch, resulting in 11 positions per row. This fine pitch allows high signal density within a compact footprint, making it ideal for mezzanine board connections in space-constrained applications such as embedded compute modules and small-form-factor daughter cards.
How many mating cycles is the high-reliability socket rating designed to support in aerospace or defense systems?
SAMTEC high-reliability (H) socket strip contacts are engineered to maintain specified contact resistance below 20 milliohms across a minimum of 200 mating cycles, which far exceeds standard connector ratings. This extended mating cycle rating makes them appropriate for aerospace avionics, defense electronics, and industrial systems where boards may be removed and reinstalled repeatedly during maintenance or field upgrades.
What advantage does the low-profile (LC) configuration offer over standard-height socket strips on compact PCB stacks?
The low-profile (LC) configuration reduces the above-board height of the connector body, minimizing the total board stacking distance to as little as 4 mm or less depending on the mating header. This is critical in compact PCB stack applications where total system height is constrained by enclosure dimensions, such as in portable instruments, UAV electronics, or wearable industrial devices.
For a small-form-factor compute module design, how does tape-and-reel packaging affect production line setup for the SFM-111-L2-H-D-LC-TR?
Tape-and-reel (TR) packaging loads directly into standard SMT pick-and-place feeders without requiring manual component orientation, reducing setup time per feeder changeover by several minutes in high-mix production environments. For a 22-position fine-pitch SMT socket at 1.27 mm pitch, consistent reel packaging also reduces the risk of placement errors that can cause opens or shorts on fine-pitch pads.
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About SAMTEC
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