SFM-110-T2-LM-D-A-P SAMTEC Connector (Other) In Stock

SAMTEC SFM-110-T2-LM-D-A-P is a 20-position dual-row surface mount high-reliability socket strip with 0.050" (1.27 mm) pitch, low-mid mating height, designed for precise board-to-board and mezzanine interconnects.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
SFM-110-T2-LM-D-A-POther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
20
Lifecycle
ACTIVE
Category
Connector
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 20-position dual-row configuration with 0.050" (1.27 mm) pitch enabling high-density signal routing in a compact SMT footprint
  • Low-mid (LM) mating height option balances board separation and mechanical stability for mezzanine card designs
  • High-reliability socket construction rated for extended temperature ranges and repeated mate/unmate cycles
  • Dual-row (D) layout with 10 contacts per row provides balanced signal distribution across compact mezzanine board interfaces

Applications

SFM-110-T2-LM-D-A-P targets high-reliability mezzanine card and board-to-board interconnect applications in networking equipment, embedded computing, and defense electronics. The 20-position dual-row 1.27 mm pitch socket is suited for FPGA expansion daughter cards, sensor interface modules, and compact industrial control boards where reliable low-profile SMT connections are required.

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)

Datasheet

SFM-110-T2-LM-D-A-P Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What contact arrangement and pitch does SFM-110-T2-LM-D-A-P use for board-to-board connections?

SFM-110-T2-LM-D-A-P provides 20 positions in a dual-row layout with 10 contacts per row at 0.050" (1.27 mm) pitch. This compact 1.27 mm pitch dual-row arrangement allows dense signal routing between boards in mezzanine card designs, FPGA daughter modules, and embedded computing interfaces where PCB space is limited.

What does the LM (low-mid) mating height designation mean for SFM-110-T2-LM-D-A-P stack height?

The LM (low-mid) designation specifies an intermediate mating height between the shortest (low) and taller (high) SFM series variants. This gives designers flexibility for board-to-board spacing that is taller than a minimum-clearance stack but shorter than a full-height mated pair, typically in the range of a few millimeters, accommodating components between the boards while keeping the assembly compact.

How does SFM-110-T2-LM-D-A-P compare to SFM-103-L2-S-D-K-TR in terms of pin count and application scale?

SFM-110-T2-LM-D-A-P has 20 positions versus only 6 on SFM-103-L2-S-D-K-TR, providing more than 3 times the contact count at the same 0.050" (1.27 mm) pitch in a dual-row format. SFM-110 suits medium-density interface needs such as 20-pin FPGA expansion headers, while SFM-103 is better for minimal-count debug or control interfaces requiring fewer than 10 contacts per row.

What environments is SFM-110-T2-LM-D-A-P qualified for given its high-reliability series designation?

As part of SAMTEC's high-reliability SFM series, SFM-110-T2-LM-D-A-P is qualified for operation across a -55°C to +125°C temperature range. This broad range suits defense, aerospace, and harsh industrial environments. The connector is designed for repeated mate/unmate cycles and maintains contact integrity under mechanical vibration, making it appropriate for ruggedized embedded computing and field-deployed systems.

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AvailabilityIn Stock
Reference Price (USD)
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pcs

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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

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