SFM-110-L2-H-D-LC-TR SAMTEC Connector (Other) In Stock
SFM-110-L2-H-D-LC-TR is a 20-position dual-row high-reliability surface-mount socket strip from Samtec with a 1.27 mm (0.050 inch) pitch and low-profile LC contact style for compact board-to-board connections. It is supplied in tape-and-reel format for automated PCB assembly. From stock, worldwide shipping available.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 20
- Lifecycle
- ACTIVE
- Datasheet
- SFM-110-L2-H-D-LC-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-110-L2-H-D-LC-TR?
- 20-position dual-row layout at 1.27 mm (0.050 inch) pitch delivering fine-pitch SMT signal interconnect in a small footprint
- LC (low-clearance) contact style minimizing vertical height above the PCB for ultra-compact stack-height applications
- High-reliability gold-plated contacts ensuring consistent low contact resistance across thousands of mating cycles
- Tape-and-reel (TR) packaging enabling automated high-volume pick-and-place PCB assembly
- Surface-mount termination compatible with standard SMT reflow soldering processes for efficient manufacturing
What is SFM-110-L2-H-D-LC-TR used for?
The SFM-110-L2-H-D-LC-TR is used in compact board-to-board and mezzanine card interconnect applications in embedded computing, wearable electronics, and industrial sensor modules where 20 signals must be routed in a 1.27 mm pitch footprint with minimal connector height. Its high-reliability construction and LC low-profile contact style make it suitable for aerospace, defense, and ruggedized industrial designs with tight vertical clearance constraints. The tape-and-reel format supports efficient automated assembly for high-volume production.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-110-L2-H-D-LC-TR datasheet?
SFM-110-L2-H-D-LC-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-110-L2-H-D-LC-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the LC suffix indicate in the SFM-110-L2-H-D-LC-TR part number, and how does it affect the connector profile?
The LC suffix stands for low-clearance contact style, which reduces the vertical height of the socket strip above the PCB surface compared to standard contact styles. This makes the SFM-110-L2-H-D-LC-TR ideal for board-stack assemblies with tight vertical clearance budgets, such as module-on-carrier designs, wearable devices, or aerospace avionics modules where minimizing the gap between 2 PCBs at 1.27 mm pitch is essential.
How many signals can the SFM-110-L2-H-D-LC-TR carry, and how is its dual-row layout arranged?
The SFM-110-L2-H-D-LC-TR carries 20 signals across 2 rows of 10 contacts each at a 1.27 mm (0.050 inch) pitch. Compared to an equivalent single-row 20-pin strip at the same pitch, the dual-row design reduces the connector length by approximately 50 percent, allowing more compact board designs in sensor modules, miniature embedded computers, and FPGA mezzanine cards.
Is the SFM-110-L2-H-D-LC-TR suitable for automated SMT assembly, and does it come in tape-and-reel format?
Yes, the SFM-110-L2-H-D-LC-TR is a surface-mount device supplied in tape-and-reel (TR) format, making it fully compatible with automated pick-and-place machines and standard reflow soldering processes. The 1.27 mm pitch and SMT termination across all 20 positions allow precise robotic placement and consistent solder joint quality in high-volume production runs for industrial electronics and embedded computing hardware.
Why choose the SFM-110-L2-H-D-LC-TR over a standard-pitch 2.54 mm socket strip for a 20-position board interconnect?
The SFM-110-L2-H-D-LC-TR at 1.27 mm pitch occupies roughly half the PCB area of an equivalent 2.54 mm pitch 20-position socket strip. This fine pitch is the preferred choice in miniaturized designs, such as wearable sensor nodes, small embedded SoM (System-on-Module) boards, or avionics sub-modules, where board space is the primary constraint and the 20-signal interface must fit within a very compact PCB footprint without sacrificing high-reliability contact performance.
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