SFM-110-L2-FM-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-110-L2-FM-D-A-K is a 20-position, dual-row, high-reliability socket strip with 0.050" (1.27 mm) pitch for surface mount assembly. It provides 20 circuits across two rows for compact board-to-board interconnect in embedded and industrial designs. Available in stock globally with fast worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 20
- Lifecycle
- ACTIVE
- Datasheet
- SFM-110-L2-FM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 20-position dual-row socket strip at 0.050" (1.27 mm) pitch for compact, high-density board-to-board signal routing
- Surface mount (SMT) termination compatible with standard reflow soldering and automated pick-and-place assembly lines
- High-reliability contact system with gold-plated contacts rated for extended mating cycles in demanding environments
Applications
The SFM-110-L2-FM-D-A-K is targeted at compact PCB mezzanine and daughter-card applications in embedded computing, wireless modules, and sensor interface boards requiring 20 signal channels at 1.27 mm pitch. Its small 20-position footprint is frequently used on IoT module headers, RF board interconnects, and small form-factor industrial expansion cards. Designers value its high-reliability contacts and SMT assembly compatibility for low-profile stacking designs.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the circuit count and pitch of the SFM-110-L2-FM-D-A-K, and how compact is its PCB footprint?
The SFM-110-L2-FM-D-A-K provides 20 circuits in a dual-row configuration on a 0.050-inch (1.27 mm) pitch. Its footprint spans 10 positions per row at 1.27 mm spacing, making the total connector length approximately 12.7 mm. This compactness is advantageous in small embedded modules, IoT boards, and wireless daughter cards where board area is tightly constrained.
How does the SFM-110-L2-FM-D-A-K compare to a 20-position 2.54 mm pitch connector in terms of board space savings?
At 1.27 mm (0.050-inch) pitch, the SFM-110-L2-FM-D-A-K occupies half the row-to-row and column-to-column spacing of a standard 2.54 mm pitch connector. For 20 circuits, this reduces the connector footprint area by approximately 75% compared to a 2.54 mm pitch alternative, enabling 20 signal connections in designs that cannot accommodate the larger standard-pitch format.
For a wireless RF module daughter card, what mating header complements the SFM-110-L2-FM-D-A-K?
The SFM-110-L2-FM-D-A-K mates with SAMTEC SFM-series male headers at 0.050-inch (1.27 mm) pitch with a matching 20-position, dual-row layout. The complementary header inserts into the socket strip to form a board-stacking interconnect providing 20 signal paths. Stack heights available in the SAMTEC SFM system typically range from 4 mm to 15 mm, offering flexibility for wireless RF modules with varying component heights.
Is the SFM-110-L2-FM-D-A-K suitable for industrial environments, and what makes it a high-reliability option?
Yes, the SFM-110-L2-FM-D-A-K is designated as a high-reliability connector by SAMTEC. Its gold-plated contacts resist oxidation across 20 positions for operating temperatures ranging from -55°C to +125°C. The SMT footprint with robust solder joints provides mechanical retention adequate for vibration-exposed industrial automation and ruggedized embedded computing applications.
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