SFM-109-T2-LM-D-LC SAMTEC Connector (Other) In Stock
SAMTEC SFM-109-T2-LM-D-LC is an 18-position dual-row high-reliability socket strip on 0.050" (1.27 mm) pitch with low-profile (LM) surface-mount termination and low-crosstalk (LC) contacts for minimal inter-signal interference. Engineered for high-speed mezzanine and module-on-board interconnects. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 18
- Lifecycle
- ACTIVE
- Datasheet
- SFM-109-T2-LM-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-109-T2-LM-D-LC?
- 18-position dual-row configuration on 0.050 inch (1.27 mm) pitch providing 36 total contacts in a minimal SMT footprint
- Low-crosstalk (LC) contact geometry engineered for signal integrity at multi-GHz data rates on differential pairs
- Low-mount (LM) profile reduces stacked board height, enabling ultra-thin module stacking in space-constrained enclosures
What is SFM-109-T2-LM-D-LC used for?
The SFM-109-T2-LM-D-LC is applied in high-speed mezzanine board assemblies, FPGA daughter cards, and miniaturized system-on-module platforms where a 36-contact low-profile interface with minimal signal crosstalk is essential. The LM (low-mount) height option makes it particularly valuable in slim form-factor chassis where total board-stack clearance must remain under 3 mm. Engineers in defense, telecommunications, and medical imaging equipment specify this connector when signal integrity above 1 GHz must be preserved across the mezzanine interface.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-109-T2-LM-D-LC datasheet?
SFM-109-T2-LM-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-109-T2-LM-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What distinguishes SFM-109-T2-LM-D-LC from SFM-109-T2-H-D-LC in a mezzanine stack where board clearance is limited?
The LM (low-mount) variant of the SFM-109 series provides a shorter contact stand-off height than the H (high-mount) version, reducing the mated board-to-board gap by approximately 1 mm to 2 mm. In a slim chassis where total stack height must remain below 4 mm, the LM version is the preferred choice, while the H version suits designs that need clearance for taller components between the two boards.
How does the LC (low-crosstalk) contact option benefit a design routing LVDS pairs through the SFM-109-T2-LM-D-LC?
LVDS signals at 800 Mbps to 3.2 Gbps are sensitive to near-end and far-end crosstalk from adjacent contacts. The LC contact geometry in the SFM-109 series uses controlled-impedance pin geometry and optimized housing material to limit crosstalk below -40 dB at 1 GHz, preserving differential signal fidelity across the 18-position connector without requiring additional signal filtering on the receiving board.
For a compact medical imaging module, does the 0.050 inch pitch of SFM-109-T2-LM-D-LC offer enough contact density to replace a 0.100 inch header?
Yes. The 0.050 inch (1.27 mm) pitch fits twice as many contacts per unit length compared with a 0.100 inch header. The 18-position SFM-109 body occupies approximately 10.9 mm, whereas an equivalent-count 0.100 inch header would span 22 mm. For a medical imaging PCB where board real estate is at a premium and the interconnect must carry 36 independent signals, the SFM-109-T2-LM-D-LC delivers the required density in roughly half the connector footprint length.
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